Laser selective melting forming device and method

Abstract

The invention belongs to the field of the additive manufacturing correlation technique, and discloses a laser selective melting forming device and method. The forming device comprises an industrial personal computer, a magnet exciting coil set, an electronic voltage adjuster, an adjustable resistor, a single-chip microcomputer, an ultrasonic power source and an ultrasonic vibration device. The magnet exciting coil set comprises multiple magnet exciting coils, and the multiple magnet exciting coils and the ultrasonic vibration device are arranged around a substrate of a forming cavity during use. The magnet exciting coils are connected with the industrial personal computer and the adjustable resistor, and the electronic voltage adjuster is connected with the magnet exciting coils and the adjustable resistor. The ultrasonic power source is connected with the single-chip microcomputer and the ultrasonic vibration device. The single-chip microcomputer is further connected to the electronicvoltage adjuster. The industrial personal computer is used for controlling the angle and on-off of the magnet exciting coil set according to different laser scanning phase angles so as to achieve zoning control of a magnetic field. The single-chip microcomputer is used for controlling the amplitude and frequency of the ultrasonic vibration device. According to the laser selective melting formingdevice and method, high-performance laser selective melting forming is achieved, and structure consistency is improved.

Description

technical field [0001] The invention belongs to the technical field related to additive manufacturing, and more specifically relates to a laser selective melting forming equipment and method. Background technique [0002] In recent years, additive manufacturing technology has developed very rapidly and has been widely used in aerospace, biomedicine and other fields. Among them, laser selective melting forming technology can directly manufacture high-performance metal parts from CAD models and metal powder / wire materials. The STL file is sliced ​​according to a certain layer thickness to generate a two-dimensional laser processing trajectory, and the equipment pre-lays / coaxially inputs the metal powder according to the generated processing trajectory. After the scan is completed, the substrate is lowered to a certain depth and the process is repeated until the part is completed, layer by layer to complete the preparation of the entire metal part. [0003] Due to the laser s...

AI Technical Summary

Problems solved by technology

The purpose of this equipment is to refine the grains, reduce thermal stress, eliminate thermal cracks, pores and columnar crystals by affecting the solidification and crystallization process without changing the material composition, and solve the problem of forming parts in the laser selective melting forming technology. Metallurgical defects such as holes and cracks and anisotropy caused by columnar crystals

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