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A kind of positive photoresist stripping and cleaning composition and application thereof

A technology of positive photoresist and cleaning composition, which is applied in the fields of optics, photomechanical equipment, photosensitive material processing, etc. It can solve the problem of photoresist residue on the surface of the substrate, and achieve the effect of improving the degree of corrosion and less erosion

Active Publication Date: 2022-01-28
JIANGYIN JIANGHUA MICROELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is no obvious corrosion on the surface of the substrate after being treated with the above degumming and cleaning composition, but photoresist remains on the surface of the stripped substrate

Method used

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  • A kind of positive photoresist stripping and cleaning composition and application thereof
  • A kind of positive photoresist stripping and cleaning composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0032] The composition of embodiment 1-4 and the percentage by weight of each component see the following table:

[0033]

[0034] In the above table, the quaternary ammonium hydroxide in Examples 1-4 is tetramethylammonium hydroxide, the water-soluble alkanolamine is N-methylethanolamine, and the water-soluble organic polar solvent is N-methylpyrrolidone , The ester compound with cyclohexyl is ethyl cyclohexanecarboxylate.

[0035] The weight percent of each component in embodiment 5-9 is based on embodiment 2, and difference is that quaternary ammonium hydroxide is tetraethylammonium hydroxide, and water-soluble alkanolamine is diethanolamine, and water-soluble organic polar solvent is DMSO (dimethylsulfoxide).

Embodiment 6

[0036] The component selection of Examples 6-9 is based on Example 5, the difference is that the ester compound with cyclohexyl in Example 6 is cyclohexyl formate, and the ester compound with cyclohexyl in Example 7 is 4-tert-butylcyclohexyl Acetate, the ester compound with cyclohexyl in embodiment 8 is cyclohexyl mercaptopropionate, the ester compound with cyclohexyl in embodiment 9 is cyclohexyl mercaptopropionate and cyclohexyl propionate in weight ratio 1:1 combined.

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Abstract

The invention discloses a positive photoresist stripping and cleaning composition. The main components include quaternary ammonium hydroxides, water-soluble alkanolamines, water-soluble organic polar solvents and cyclohexyl ester compounds. The positive photoresist stripper cleaning composition contains an ester compound with a cyclohexyl group, the ester compound is stable in an alkaline organic phase, and the quaternary ammonium hydroxide is ionized in the washing solution to generate hydroxide ions, The washing solution is alkaline, and the ester compound with cyclohexyl is hydrolyzed under alkaline conditions to form acid and alcohol and maintain the reaction balance. The acid can quickly neutralize the hydroxide ions in the alkali solution, improving the washing process for the metal layer on the wafer surface degree of corrosion. The invention also discloses the application of the positive photoresist stripping cleaning composition in the substrate photoresist stripping process.

Description

technical field [0001] The invention relates to the technical field of photoresist stripping and cleaning compositions, in particular to a positive photoresist stripping and cleaning composition and its application. Background technique [0002] In the TFT-LCD process, a film is formed on the array substrate by Sputter or CVD, and the photoresist is used as a mask to obtain the desired pattern on the film layer by wet etching or dry etching. The process of removing the photoresist used as a mask is called lift-off. Photoresist can be divided into positive photoresist and negative photoresist according to the mechanism of action. The exposed area of ​​the positive photoresist is easier to dissolve in the developer, and the positive photoresist resin is novolac resin. [0003] Regarding the removal of positive photoresist (such as AZ4620 series) on 8-inch and 12-inch wafers in the semiconductor wafer-level packaging and testing industry, the following non-aqueous degumming cl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/42
CPCG03F7/426
Inventor 李森虎承明忠朱龙邵勇顾玲燕陈林殷福华赵文虎姚玮
Owner JIANGYIN JIANGHUA MICROELECTRONICS MATERIAL