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Virtual switching method and device, server and storage medium

A technology of virtual switching and chip exchange, applied in the field of computer science and automation control, can solve the problems of limited workshop height, affecting production efficiency, affecting takt time, etc., to improve the efficiency of chip exchange, save moving time, and improve production efficiency Effect

Inactive Publication Date: 2019-01-11
ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for multi-layer equipment, such as baking (Oven) furnaces, limited by the three-dimensional height of the workshop, the opening size of each furnace layer cannot meet the minimum requirements for continuous sheet exchange, that is, the opening size of the furnace opening Can not meet the height required for continuous pick and place
In the prior art, the multi-layer equipment can only be picked and placed by single fetch and single release, but this single fetch and single release method will increase the moving time of the robot, affect the overall cycle time, and thus affect production efficiency

Method used

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  • Virtual switching method and device, server and storage medium
  • Virtual switching method and device, server and storage medium
  • Virtual switching method and device, server and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] figure 1 It is a flow chart of the virtual switching method in Embodiment 1 of the present invention. This embodiment is applicable to the situation of switching slices in a device. The method can be executed by a virtual switching device, which can be implemented in software and / or hardware. For example, the device can be configured in a server. The method may specifically include:

[0026] S110. Obtain a film output signal of the target layer in the target device.

[0027] Wherein, the target device may be a multi-layer device, and when the opening size of other single-layer devices cannot meet the minimum requirement for continuous chip exchange, the single-layer device may also be the target device. The number of target devices is not limited in this embodiment. A single target device may execute the method in this embodiment, or multiple target devices may be used as a whole device to execute the method in this embodiment. In this embodiment, a multi-layer equip...

Embodiment 2

[0038] Figure 4 It is a flow chart of the virtual switching method in Embodiment 2 of the present invention. On the basis of the foregoing embodiments, this embodiment further optimizes the foregoing virtual switching method. Correspondingly, the method in this embodiment specifically includes:

[0039] S210. Obtain a receiving signal of the target layer in the target device.

[0040] The target layer is any working layer in the target device that sends out the receiving signal. When there is no glass sheet in any working layer of the target device, the working layer will send a receiving signal to the server, and this working layer is the target layer, and the server can obtain the receiving signal of the target layer. The target layer can be transformed as needed.

[0041]S220. If it is confirmed that the robot has a film-carrying mechanical arm, control the film-carrying mechanical arm of the robot to release the film in the target layer according to the film receiving...

Embodiment 3

[0054] Figure 5 It is a schematic structural diagram of a virtual switching device in Embodiment 3 of the present invention, and this embodiment is applicable to the case of switching slices in a device. The virtual switching device provided by the embodiment of the present invention can execute the virtual switching method provided by any embodiment of the present invention, and has corresponding functional modules and beneficial effects for executing the method. The device specifically includes a chip output module 310 and a chip exchange module 320, wherein:

[0055] A film output module 310, configured to obtain a film output signal of the target layer in the target device;

[0056] The slice swapping module 320 is configured to control the robot to perform a slice swap operation on the target layer if it is confirmed that the robot has a robotic arm with a slice and a robotic arm without a slice.

[0057] Optionally, the device further includes a signal module, and the...

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Abstract

The embodiment of the invention discloses a virtual switching method and device, a server and a storage medium. The method comprises the following steps that an output signal of a target layer in a target device is obtained; and if it is confirmed that a robot has a piece manipulator and a piece-free manipulator, the robot is controlled to exchange pieces on the target layer. The robot moving timecan be shortened. Equipment exchanging efficiency is improved. The beat time is reduced, and production efficiency is improved.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of computer science and automation control, and in particular to a virtual switching method, device, server and storage medium. Background technique [0002] In the manufacturing industry, the takt time (Tact Time) in the production line determines the overall efficiency of the production line when it is full, and directly affects the economic benefits of the production line. The takt time of the entire production line is affected by the individual takt time of each device in the production line. [0003] In the upstream and downstream handshake process, the continuous exchange mode (Exchange mode) is generally used to save the robot's pick-and-place and moving time. The continuous exchange mode is a way to take and place as one action. However, for multi-layer equipment, such as baking (Oven) furnaces, limited by the three-dimensional height of the workshop, the opening size of ea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25J9/16
CPCB25J9/16B25J9/1679
Inventor 秦宝荣
Owner ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL