Method and device for polishing semiconductor wafer

A grinding method and semiconductor technology, applied in grinding equipment, semiconductor devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of measurement disturbance, lower measurement accuracy, longer feedback time, etc., and achieve the effect of shortening the moving time
CN105474367AActive Publication Date: 2016-04-06WINGO TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WINGO TECH CO LTD
Publication Date
2016-04-06

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Abstract

The present invention is provided with a polishing step for polishing a semiconductor wafer (W) using a polishing means (1), a measurement step for measuring the shape of the semiconductor wafer (W) using a measurement means (3) before the polished surface of the polished semiconductor wafer (W) becomes a hydrophilic surface, and a polishing condition setting step for setting, using a polishing condition setting means (51), the polishing condition for the polishing step on the basis of the result of measuring the shape of the semiconductor wafer (W).
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Description

technical field

[0001] The invention relates to a grinding method and a grinding device for a semiconductor wafer. Background technique

[0002] Generally, polishing of a semiconductor wafer is performed in multiple stages. Specifically, it is roughly divided into rough grinding for the purpose of increasing the flatness of the semiconductor wafer, and finish grinding for the purpose of reducing the surface roughness. Furthermore, studies have been made to perform such high-precision polishing of semiconductor wafers (for example, refer to Patent Document 1).

[0003] In the double-sided polishing device used in the method described in Patent Document 1, a light emitting unit that emits parallel light rays and a photosensitive unit that receives parallel light rays are arranged to face the internal gear.

[0004] In such a double-sided polishing device, if the carrier and the semiconductor wafer inserted into the carrier hole of the carrier enter the light transmission are...

Claims

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