LED lamp

Abstract

The invention belongs to the technical field of optoelectronic devices, and particularly relates to an LED lamp. Since LED chips generate heat by emitting light, the heat dissipation range is expandedby a metal substrate, and as the temperature rises, heat conduction fluid volatilizes and flows into an airbag through air outlet pipes; volatilized gas drives large fans to rotate, the large fans rotate to accelerate gas flow, and the heat dissipation effect is improved. The gas enters the airbag, the airbag expands to increase the inner space of the airbag, the contact area of the airbag and the outside words is increased, the gas is in contact with the inner wall of the airbag, and the heat dissipation effect is improved. The heat conduction fluid passes through return pipes by cooling, and due to the rotation of flexible shafts, the rotation of the flexible shafts in the return pipes can effectively slow down the back-flow velocity and increase the cooling time; and at the same time,the rotation of small fans further improves the efficiency of heat dissipation and cooling. After cooling, the reflowed heat conduction fluid performs cooling on the metal substrate once on the one hand, and on the other hand, the reflowed heat conduction fluid flows back to a glass container, and heat conduction fluid in the glass container is further cooled, so that the purpose of cooling the lamp is achieved.

Description

technical field [0001] The invention belongs to the technical field of optoelectronic devices, in particular to an LED lamp. Background technique [0002] A light-emitting diode (Light-EmittingDiode, LED) is a semiconductor component. At the beginning, it was mostly used as indicator lights, display light-emitting diode boards, etc.; with the emergence of white LEDs, it was also used as lighting. In the LED lighting system, the decisive factor that determines its luminescence and service life is the heat dissipation of the chip, so the heat dissipation of LED lamps has always been the focus of attention. The aluminum heat dissipation structure used in the early days used multiple heat sinks to make waves or folds to increase the contact area with the air, thereby reducing the chip temperature. With the increase of LED chip power, heat production also increases, and the original aluminum heat dissipation structure lamps can no longer meet the requirements. In order to impr...

AI Technical Summary

Problems solved by technology

[0004] In order to make up for the shortcomings of the existing technology and solve the problem that the heat dissipation effect of LED lamps is not high, and the heat dissipation of the thermal fluid cannot be achieved, so as to achieve overall heat dissipation, the present invention provides a technical solution to solve this problem

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