A Method of Improving Measurement Accuracy of Semiconductor Temperature Sensor
A technology of temperature sensor and measurement accuracy, applied in thermometers, measuring heat, measuring devices, etc., can solve the problems of temperature sensor measurement error calibration, etc., to achieve the effect of improving accuracy, low cost, and avoiding calibration inconsistency
Active Publication Date: 2020-11-10
EXCELIO TECH SHENZHEN
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0034] The purpose of the present invention is to use the resources of the temperature sensing system with non-volatile built-in memory to write a series of key calibration parameter information into a series of fixed addresses of the non-volatile built-in memory unit, thereby solving the problem of existing temperature sensor Problems of measurement error calibration, maintaining consistency of the calibrated temperature environment, and generally enabling accurate temperature measurement and wireless transmission at low power cost
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0078] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0079] Such as Figure 6 Shown is a flow chart of the semiconductor temperature sensor calibration method of the present invention, a method for improving the measurement accuracy of the semiconductor temperature sensor described in the present invention, comprising the following steps:
[0080] S1, using the circuit model to generate two voltage values V that are linearly related to temperature changes BE1 , V BE2 ;
[0081] S2, calculate the above V BE1 , V...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to the technical field of the semiconductor device and the temperature sensor, specifically a method for improving measurement precision of a semiconductor temperature sensor. The method comprises the following steps: implementing calibration on a critical ratio parameter X at a standard calibration temperature point, writing a deviation value in a built-in non-volatile memory unit so that the temperature sensor can read the deviation value which is written when performing calibration at any time in the actual use and make the deviation compensation; for a calibration operation at a non-standard calibration point, segmenting an experience deviation value of the band-gap reference voltage VREF, and writing the fine deviation value of each segment in a built-in non-volatile memory unit array, thereby performing fine adjusting according to the preset deviation value after initially measuring the numerical value of the critical ratio parameter X and improving the temperature measurement precision. A defect that the calibration can be only performed on the single standard calibration in the temperature sensor is solved, and the difficulty that the temperature sensor calibrations among different batches are inconsistent is avoided.
Description
technical field [0001] The invention relates to the technical field of semiconductor devices and temperature sensors, in particular to a method for improving the measurement accuracy of semiconductor temperature sensors. Background technique [0002] The semiconductor integrated temperature sensor is based on the approximate proportional relationship between the conduction voltage of the P-N junction in the semiconductor chip and the temperature. The physical quantity processed in the electrical signal is the voltage value or current value representing the temperature information, that is, in the temperature sensor In the application, the actual temperature reading has a one-to-one relationship with the voltage or current representing the temperature information. [0003] The intelligent temperature sensor is different from the traditional temperature sensor represented by the mercury thermometer. The intelligent temperature sensor digitizes the temperature information so th...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G01K7/01
CPCG01K7/01
Inventor 吴边
Owner EXCELIO TECH SHENZHEN