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Resin composition and resin sheet

A technology of resin composition and resin, which is applied in the field of resin composition and resin sheet, can solve the problems of reduced adhesiveness and improved heat resistance, and achieve the effect of high adhesiveness and high heat resistance

Pending Publication Date: 2019-01-15
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when a maleimide compound is contained as in the resin composition described in Document 1, there is a problem that the heat resistance is improved and the adhesiveness is lowered.

Method used

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  • Resin composition and resin sheet
  • Resin composition and resin sheet
  • Resin composition and resin sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0118] Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited at all by these Examples.

[0119] · Preparation of resin composition

[0120] The materials used for the preparation of the resin composition are as follows.

[0121] (thermosetting component)

[0122]· BMI resin-1: maleimide resin having a biphenyl group (maleimide resin represented by the above general formula (3), "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.)

[0123] · BMI Resin-2: 2,2-bis[4-(4-maleimidephenoxy)phenyl]propane

[0124] BMI Resin-3: bis(3-ethyl-5-methyl-4-maleimidephenyl)methane

[0125] Allyl resin: diallyl bisphenol A

[0126] ・Epoxy resin: biphenyl type epoxy resin ("NC3000H" manufactured by Nippon Kayaku Co., Ltd.)

[0127] ・Phenolic resin: biphenyl type phenolic resin ("MEH-7851-H" manufactured by Meiwa Kasei Co., Ltd.)

[0128] Curing accelerator: 2-ethyl-4-methylimidazole

[0129] (binder component)

[0130] ...

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Abstract

A resin composition of the invention is a resin composition containing (A) a thermosetting component, wherein the thermosetting component (A) contains (A1) a maleimide resin having a biphenyl skeletonand (A2) an allyl resin.

Description

technical field [0001] The present invention relates to a resin composition and a resin sheet. Background technique [0002] A resin composition having high heat resistance can be used as a sealing material for power semiconductor elements and the like. [0003] For example, Document 1 (Japanese Unexamined Patent Publication No. 2015-147849) discloses a resin composition containing: a maleimide compound, a compound having at least any one of an allyl group and an epoxy group, an amine A compound, and a radical generator comprising at least one of an acetophenone derivative and a tetraphenylethane derivative. [0004] However, when containing a maleimide compound like the resin composition of document 1, there existed a problem that heat resistance improved and adhesiveness fell. Contents of the invention [0005] An object of the present invention is to provide a resin composition and a resin sheet that have both high heat resistance and high adhesiveness compared with c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L71/12C08K13/02C08K3/36C08K5/5435C08K5/13
CPCC08L79/085C08L2201/08C08L2203/20C08L71/123C08K13/02C08K3/36C08K5/5435C08K5/13
Inventor 柄泽泰纪
Owner LINTEC CORP
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