Continuous annealing wire drawing machine and bare copper wire surface quality improvement method
A wire drawing machine and a technology for bare copper wires, which are applied in the field of continuous annealing treatment devices for bare copper wires, and can solve problems such as affecting the surface quality of bare copper wires.
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Embodiment 1
[0037] see figure 1 , a first damping device B31 (the first damping device B31 is the first damping device 3 that is not provided with an insulating base at the bottom) is set at the middle position between the wire drawing machine outlet and the fixed speed wheel 5, the first damping device The horizontal height of B31 should be able to ensure that the bare copper wire 2 has an appropriate line pressure on the vibration damping part, and the bare copper wire 2 is in a horizontal and straight state between the outlet of the wire drawing machine, the first vibration damping device B31, and the fixed speed wheel 5;
[0038] In the annealing machine, a first damping device A32 (the first damping device A32 is provided with the first damping device 3 of an insulating base for the bottom) is respectively set at the middle position of the second lead wheel 42 and the third lead wheel 43, The bare copper wire 2 is in a straight line state on the second lead wheel 42, the third lead w...
Embodiment 2
[0040] see Figure 4 , Embodiment 2 differs from Embodiment 1: the layout of the damping device between the second conductive wheel 12 and the high-temperature conductive wheel 7 is different. In Embodiment 2, the vibration damping device between the second conductive wheel 12 and the high temperature conductive wheel 7 is set as follows: a first vibration damper is set at a row line position of about 300mm away from the second conductive wheel 12 and the second conductive wheel 12 Device A32, set a first damping device A32 at the line position about 300mm before entering the high-temperature conductive wheel 7, and the bare copper wire 2 is connected to the second conductive wheel 12, the two first damping devices A32 and the high-temperature conductive The wheels 7 are in a straight line.
Embodiment 3
[0042] see Figure 5 , Embodiment 3 is different from Embodiment 1: the layout of the damping device between the second conductive wheel 12 and the high-temperature conductive wheel 7 is different. In embodiment 3, the vibration damping device between the second conductive wheel 12 and the high temperature conductive wheel 7 is set as follows: a first vibration damper is set at a line position of about 300mm away from the second conductive wheel 12 and the second conductive wheel 12 Device A32, at the line position about 300mm before entering the high-temperature conductive wheel 7, a second damping device 6 is set (the bottom of the second damping device 6 is provided with an insulating base), and the bare copper wire 2 is placed on the second conductive wheel. 12. The first damping device A32, the second damping device 6, and the high-temperature conductive wheel 7 are in a straight line.
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