A kind of high dielectric low temperature co-fired ceramic dielectric material and preparation method thereof

A technology of low temperature co-fired ceramics and dielectric materials, applied in the field of ceramic dielectric materials, can solve the problems of high sintering temperature, low dielectric constant and high loss, and achieve high dielectric constant, high dielectric constant and low dielectric loss. Effect
CN109251027BInactive Publication Date: 2021-03-30TAIYUAN UNIV OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TAIYUAN UNIV OF TECH
Publication Date
2021-03-30
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a high dielectric low temperature co-fired ceramic dielectric material and a preparation method thereof, the material comprises the following raw materials by mass: 5-20% of glass powder and 80-95% of K2Sr4Nb6O20-0.2Sc2O3. The glass powder includes the following raw materials by mass: 15-30% of Na2CO3, 5-20% of SiO2, 10-25% of KF, and 25-40% of H3BO3. The preparation methodis as follows: weighing the raw materials according to the stoichiometric ratio of the general formula K2Sr4Nb6O20-0.2Sc2O3 to obtain a frit A; mixing the glass powder B and the 80% of 95% of the frit A according to the mass percentage for ball milling, adding an adhesive, granulating, thermally incubating at 900 DEG C -950 DEG C for 1 hour, and cooling. The high dielectric low temperature co-fired ceramic dielectric material has a low sintering temperature, a high dielectric constant and a low dielectric loss, and can be co-fired with a high conductivity silver metal internal electrode.
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Description

technical field

[0001] The invention discloses a high-dielectric low-temperature co-fired ceramic dielectric material and a preparation method thereof, belonging to the technical field of ceramic dielectric materials. Background technique

[0002] With the rapid development of modern electronic information technology, electronic circuits are developing in the direction of miniaturization, multi-function, light weight, low cost, integration and high frequency, which puts forward some new requirements for electronic components , requiring it to have high frequency, small size, high integration and high reliability. At present, the miniaturization and chipping of electronic components is an important symbol used to measure the development level of electronic components technology. In order to better adapt to the development needs of the modern electronic information technology industry, many new component integration technologies have emerged, such as low-temperature co-fired ...

Claims

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