Fabrication method of LED device and LED device
A technology of LED device and manufacturing method, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as poor color reproduction of LED devices, and achieve the effects of improving visual experience, wide color gamut and less interference.
Active Publication Date: 2019-01-22
HEFEI HUIKE JINYANG TECH
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Problems solved by technology
[0004] The purpose of the present invention is to provide a method for manufacturing an LED device, aiming to solve the technical problem of poor color reproduction of the LED device
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[0040] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0041] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are for convenience of description only, rather than indicating or implying the referred device Or ele...
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The invention is applicable to the LED technical field, Provided are a manufacturing method of an LED device and an LED device, The manufacturing method of the LED device comprises: electrically connecting a chip with a lead frame in a first groove of the support and forming a first encapsulation adhesive layer on the chip, forming an insulation adhesive layer on the first encapsulation adhesive layer, forming a quantum dot layer on the insulation adhesive layer, and forming a second encapsulation adhesive layer on the quantum dot layer. The insulation adhesive layer and the quantum dot lay are formed on the chip and the first encapsulation adhesive layer, the insulating adhesive layer protects the quantum dot layer from heat from the chip and lead frame, The quantum dot layer can convertthe light emitted from the chip, and the interference of the quantum dot to the light emitted from the chip is small. The LED device obtained in this way can be used in the liquid crystal reduction technology, so that the color gamut of the liquid crystal display is wider, the color saturation is higher, the picture is closer to the reality, and the visual perception of the user is improved.
Description
technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to a method for manufacturing an LED device and the LED device. Background technique [0002] An LED (Light-Emitting Diode, light-emitting diode) includes a chip arranged in a bracket and an encapsulation adhesive layer packaged on the chip. The encapsulation adhesive layer includes silica gel and fluorescent powder. After the current passes through the chip, different types of chips are excited to emit light of different colors. When the light irradiates the phosphor powder in the encapsulation adhesive layer, the phosphor powder will be excited, and the light of different wavelengths will be interfered. Or form a single color after absorption. For example, the blue light chip excites the phosphor to emit yellow light, and when the blue light and yellow light are mixed, white light will be obtained, that is, a white light LED will be obtained. [0003] However, since the...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L33/48H01L33/50H01L33/54H01L33/56
CPCH01L33/483H01L33/502H01L33/507H01L33/54H01L33/56H01L2933/005
Inventor 王智勇陈祖华
Owner HEFEI HUIKE JINYANG TECH