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Three-dimensional micro channel and a pulsating flow heat dissipation device

A heat dissipation device and micro-channel technology, applied in cooling/ventilation/heating transformation, modification by liquid cooling, electrical components, etc., can solve the problems of low heat exchange rate and slow heat dissipation, and achieve uniform temperature distribution and large heat dissipation area , good cooling effect

Active Publication Date: 2019-01-25
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the deficiencies of the prior art, the present invention improves and designs a three-dimensional microchannel and pulsating flow heat dissipation device, further solving the problem of low heat exchange rate and slow heat dissipation in the existing heat dissipation device

Method used

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  • Three-dimensional micro channel and a pulsating flow heat dissipation device
  • Three-dimensional micro channel and a pulsating flow heat dissipation device
  • Three-dimensional micro channel and a pulsating flow heat dissipation device

Examples

Experimental program
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Effect test

Embodiment 1

[0043] A micro-channel cold plate based on metal 3D printing technology, the micro-channel cold plate includes a bottom cold plate body 1, a middle layer cold plate body and a top layer cold plate body, distributed on the working surface of the plate body 1 Oval or rhombus-shaped microchannel components, each layer of cold plate is provided with heat dissipation channels, so that the coolant can pass through each layer of cold plate one by one to complete a round of heat dissipation.

Embodiment 2

[0045] On the basis of Example 1, in the case where the heat source range of a certain part is relatively large, the cooling liquid can be injected from the liquid injection port 7, through the bottom microchannel 3 and the heat source for convective heat dissipation, and through the aluminum refrigeration plate in the form of heat conduction The heat of the heat source is transferred to the cooling liquid; afterward, the cooling liquid passes through the heat dissipation channel 13 of the middle layer to the micro channel 6 of the middle layer for a new round of convective heat dissipation; Finally, the coolant is discharged from the liquid outlet 11 to complete a round of heat dissipation. After passing through the three-dimensional laminated radiator, compared with the ordinary single-layer radiator, more heat from the heat source can be taken away, and the heat dissipation efficiency is higher.

Embodiment 3

[0047] When metal 3D printing technology is used for one-time printing of the three-dimensional microchannel radiator, the one-time printing of the bottom cold plate 1, the bottom microchannel 3, the bottom heat dissipation channel 12 and the installation hole 15 is firstly completed; then the bottom cover plate 2, The one-time printing of the middle layer cold plate 4, the middle layer heat dissipation channel 13, the liquid injection port 7 and the installation port 14; and then complete the one-time printing of the middle layer cover plate 5, the top layer cold plate 8, the top layer heat dissipation channel 14 and the installation hole 15 ; Finally, the one-time printing of the top cover plate 9, the liquid outlet 11 and the mounting hole 15 is completed;

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Abstract

The invention discloses a three-dimensional microchannel and pulsating flow heat dissipation device, which relates to the technical field of radiators, in particular to a novel three-dimensional microchannel heat dissipation device using pulsating or intermittent fluid and a 3D printing manufacturing method thereof. The heat dissipation device comprises a radiator, a pulse pump, a cooler and a connecting pipe; The heat sink is closely attached to the heat source, Connect the radiator by connecting the pipes, pulsating pump, cooler in series, The heat sink comprises a liquid injection port, a bottom layer heat dissipation structure, an intermediate layer heat dissipation structure, a top layer heat dissipation structure, a liquid outlet, the bottom layer heat dissipation structure, the intermediate layer heat dissipation structure and the top layer heat dissipation structure, which are stacked in turn, and have good heat dissipation effect, and the heat dissipation effect is further improved after the device is made into an organic whole by adopting the 3D printing method.

Description

technical field [0001] The invention relates to the technical field of heat sinks, in particular to a novel three-dimensional microchannel heat sink using pulsating or intermittent fluid for heat dissipation and a 3D printing manufacturing method thereof. Background technique [0002] With the development of electronic equipment in the direction of miniaturization and integration, the integration of various components is getting higher and higher, the packaging density is getting smaller and smaller, and the heat flux density of electronic equipment is increasing sharply. The traditional air cooling technology has Unable to meet the heat dissipation requirements of high heat flux devices, efficient liquid cooling technology has been applied to the heat dissipation of electronic equipment. Micro-channel liquid cooling technology stands out among many heat dissipation technologies because of its high heat dissipation efficiency. This technology can greatly improve the cooling ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/20327H05K7/20336
Inventor 徐尚龙陈鹏艳徐冲谢俊明
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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