Automatic overheating prompt device of high-voltage lead joint

Abstract

An automatic overheating prompt device of a high-voltage lead joint relates to the technical field of high-voltage power transmission. The device comprises upper and lower casings in up-down butt joint, an area covered between the upper and lower casings forms a sealing space, common ends of the upper and lower casings are hinged, the other ends, opposite to the hinged ends, are opening / closing ends, and the high-voltage lead joint is covered in the sealing space via the opening / closing ends; and an installation casing is arranged in the outer bottom surface of the lower casing, a circuit board and a power supply module are installed in the installation casing, the circuit board is electrically connected with the power supply module, and a temperature sensor, a microcontroller, a communication interface and an alarm signal lamp are arranged on the circuit board. The high-voltage lead joint is sealed, dust and rain are prevented, real-time temperature detection is realized, and automatic alarming is achieved.

Description

technical field [0001] The invention relates to the technical field of high-voltage power transmission, in particular to an automatic prompting device for high-voltage wire joint overheating. Background technique [0002] In the power system, high-voltage wire joints often generate local heating due to poor contact, and the long-term accumulation of local heating will lead to local overheating at the joints. And when this local overheating is serious, it will heat the wire to the melting temperature of the metal, causing more serious accidents. Therefore, in order to avoid this situation, it is necessary to regularly measure (monitor) the temperature of the high-voltage wire joints of the outdoor substation, switch cabinet, ring network cabinet and 10kV distribution network system; [0003] At present, the commonly used temperature measurement methods include daily measurement method, wax chip method, infrared imager method, and optical fiber temperature deletion method. Ho...

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Problems solved by technology

[0003] At present, the commonly used temperature measurement methods include daily measurement method, wax chip method, infrared imager method, and optical fiber temperature deletion method. However, the above methods have large errors, and must be experienced operators, and cannot transmit temperature data in real time. , can not take the initiative to alarm, which affects the temperature monitoring of high-voltage wire joints;

[0004] Furthermore, most of the high-voltage wire joints use heat-shrinkable wire joints. The disadvantage is that the sealing performance is low, and it is easy to raise dust and attach to the wire core wire, causing current leakage or even breakdown. To the high-voltage wire joints, it will cause corrosion to the high-voltage wire joints, and it will easily cause a short circuit and directly increase the temperature of the high-voltage wire joints, causing dangerous accidents

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