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A bionic transpiration cooling adaptive radiator

An adaptive radiator technology, applied in the field of heat dissipation, can solve the problems of large space occupation, high cost, complex liquid cooling radiator system, etc., to achieve the effect of improving space, improving work performance, and ensuring long-term efficient and stable operation

Active Publication Date: 2019-09-17
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the system of the liquid cooling radiator is complicated, the cost is high, and it occupies a large space. Its operation and work must rely on driving devices such as water pumps. It is generally suitable for large-scale computers, work base stations, etc.

Method used

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  • A bionic transpiration cooling adaptive radiator
  • A bionic transpiration cooling adaptive radiator
  • A bionic transpiration cooling adaptive radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment example 1

[0039] Such asfigure 1 and figure 2 As shown, the circulating working circuit of the present disclosure is composed of an evaporation chamber (including the upper cover plate 1 of the evaporation chamber and the shell 6 of the evaporation chamber), a vapor circulation pipeline 2, a liquid storage chamber 8 and a connecting capillary 7 connecting the liquid storage chamber and the evaporation chamber. , the bionic porous material 4, the filling fiber 5 and the working liquid 9 are also installed in the circulating working loop.

[0040] The upper cover plate 1 of the evaporation chamber can be made of a copper plate with good thermal conductivity to reduce heat transfer resistance. The thickness of the copper plate is about 6mm, and the size of the copper plate is selected according to the actual heat dissipation area required. The upper cover plate 1 is directly bonded to the electronic device that needs to dissipate heat, and the heat generated by the electronic device is d...

Embodiment example 2

[0047] Implementation Case 2 has the same structural principle as Implementation Case 1. The difference is that Implementation Case 1 is installed vertically. Considering that the vertical space may be insufficient for specific applications, Design Implementation Case 2 is designed for horizontal placement.

[0048] Such as image 3 and Figure 4 As shown, this case includes an evaporation chamber 10 , a steam circulation pipeline 11 , auxiliary cooling fins 12 , a liquid storage chamber 13 , a connecting pipe 14 , a bionic porous material 15 , filling fibers 17 and a steam channel 16 .

[0049] The difference between the structure of the evaporation chamber 10 in this embodiment and the first embodiment is that there is no steam channel on the upper cover plate, and the steam channel 16 is on the bionic porous material 15 , which is completed when the bionic porous material 15 is sintered.

[0050] The circulating steam pipeline 11 is designed as a straight pipeline, and an ...

Embodiment example 3

[0054] The operating principle and internal structure of this embodiment are exactly the same as those of Embodiments 1 and 2 and will not be described again. The difference is that this embodiment is designed independently for three channels.

[0055] Such as Figure 5 and Image 6 shown. This embodiment includes a circulating steam pipe cooling pipe 18 , a liquid storage pipe 19 , a circulating steam pipe connecting pipe 20 , a steam channel 21 , an evaporation chamber 22 and a connecting section 23 .

[0056] The steam channel 21, the circulating steam pipe cooling pipe 18, the liquid storage pipe 19 and the circulating steam pipe connecting pipe 20 form an independent steam circulation circuit. This embodiment includes three independent and symmetrically distributed cooling cycles, and each cycle can work independently .

[0057] The evaporation chamber 22 is cylindrical and filled with fibers and biomimetic porous material inside, and three steam channels 21 are opened...

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Abstract

The invention provides a bionic transpiration cooling self-adaptive radiator, which comprises an evaporation chamber, a liquid storage chamber, a steam circulation pipeline, a connecting pipe and a working liquid, wherein two sides of the evaporation chamber are symmetrically connected with the steam circulation pipeline, the steam circulation pipeline is connected with the two sides of the liquidstorage chamber symmetrically, the liquid storage chamber is connected with the bottom part of the evaporation chamber by means of the connecting pipe, the evaporation chamber is internally filled with filling fibers and bionic porous materials in sequence from bottom to top, the working liquid flows in the evaporation chamber, the liquid storage chamber, the steam circulation pipeline and the connecting pipe circularly, the top end of the evaporation chamber is attached with a radiating component, and the radiating component is radiated by means of the circular flow of the working liquid. The bionic transpiration cooling self-adaptive radiator is manufactured based on the transpiration cooling principle of plants, has the advantage of high radiating performance and self-adaptation without pumping power, can solve the radiating requirements of a high heat flow density surface, and is particularly suitable for radiating of electronic components with high radiating power.

Description

technical field [0001] The present disclosure relates to the technical field of heat dissipation, in particular to a bionic transpiration cooling self-adaptive radiator. Background technique [0002] Since entering the information society, electronics and communication technologies have developed rapidly. In order to meet the actual needs, electronic chips are developing in the direction of high integration, miniaturization, and high main frequency. The higher the integration level of electronic chips, the more transistors per unit area, and the faster the processing speed will be. However, it also brings the problems of high heating power and high heat flux density, which leads to an increase in the temperature of electronic components. For electronic components, as the temperature rises, when the temperature exceeds a certain limit, the failure rate will be greatly increased, and the service life and stability will be greatly reduced. Therefore, in order to ensure the h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 王鑫煜樊弘昭刘昱程林辛公明钟佳奇李飞王曼
Owner SHANDONG UNIV
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