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Metal gate structure, semiconductor device and manufacturing method thereof

A technology of metal gates and semiconductors, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve problems such as satisfactory, reduced reliability of metal layer devices, and incomplete proofs

Active Publication Date: 2020-10-02
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In some cases, the metal gate wire cutting process may result in loss of portions of the interlayer dielectric (ILD), undesired residues of metal layers and / or include other issues that may lead to reduced device reliability
[0004] Therefore, the prior art has not proven to be completely satisfactory in all respects

Method used

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  • Metal gate structure, semiconductor device and manufacturing method thereof
  • Metal gate structure, semiconductor device and manufacturing method thereof
  • Metal gate structure, semiconductor device and manufacturing method thereof

Examples

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Embodiment Construction

[0018] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, in the following description, forming a first component over or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which the first component and the second component are formed in direct contact. An embodiment in which an additional component may be formed between such that the first component and the second component may not be in direct contact. In addition, the present invention may repeat reference numerals and / or characters in various instances. This repetition is for the sake of simplicity and clarity and does n...

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PUM

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Abstract

Provided are a metal gate structure and related methods including implementing a metal gate cutting process. The metal gate cutting process includes multiple etching steps. For example, first anisotropic dry etching is performed, second isotropic dry etching is performed, and third wet etching is performed. In some embodiments, the second isotropic etch removes remaining portions of the metal gate layer including the metal-containing layer. In some embodiments, the third etch removes remaining portions of the dielectric layer. The invention also provides a semiconductor device and a manufacturing method thereof.

Description

technical field [0001] Embodiments of the present invention generally relate to the technical field of semiconductors, and more particularly, to semiconductor devices and manufacturing methods thereof. Background technique [0002] The electronics industry has experienced an ever-increasing demand for smaller and faster electronic devices capable of simultaneously supporting more increasingly complex and sophisticated functions. Accordingly, there is a continuing trend in the semiconductor industry to manufacture integrated circuits (ICs) that are low cost, high performance, and low power consumption. To date, these goals have been largely achieved by scaling down semiconductor IC dimensions (eg, minimum feature size), thereby increasing production efficiency and reducing associated costs. However, this scaling down also creates an increased complexity of the semiconductor manufacturing process. Accordingly, achieving continued advances in semiconductor ICs and devices req...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/8238H01L27/092
CPCH01L21/823821H01L21/823828H01L27/0924H01L21/823878H01L29/66545H01L29/4966H01L29/517H01L29/42376H01L29/7855H01L29/66795H01L21/78H01L21/3065H01L21/30604H01L29/7846H01L27/0886H01L21/823431H01L21/823437H01L21/32139H01L21/32135H01L29/4975H01L21/31111H01L29/0649
Inventor 黄铭淇庄英良叶明熙黄国彬
Owner TAIWAN SEMICON MFG CO LTD