Continuous full-automatic material receiving machine for semiconductor chip tape

Abstract

The invention discloses a continuous full-automatic material receiving machine for a semiconductor chip tape. The continuous full-automatic material receiving machine comprises a winding mechanism forwinding the semiconductor chip tape, a feeding mechanism for providing material trays, a glue pasting mechanism for pasting ending glue, a labeling mechanism for pasting labels on the material traysand a material tray lifting mechanism for collecting the material trays; the winding mechanism, the feeding mechanism, the glue pasting mechanism, the labeling mechanism and the material tray liftingmechanism are correspondingly mounted on an inner mounting plate; the winding mechanism is mounted in the middle of one side of the inner mounting plate; the material tray lifting mechanism is mountedat the lower end of the inner mounting plate and is positioned directly below the winding mechanism; the winding mechanism is positioned directly above the winding mechanism; the glue pasting mechanism is positioned on the other side of the winding mechanism; and the labeling mechanism is positioned on one side of the winding mechanism. The continuous full-automatic material receiving machine further comprises a material guiding mechanism for conveying a chip carrier tape. The output end of a material guiding rail in the material guiding mechanism extends to the winding mechanism and is butted with the winding mechanism.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip rewinders, in particular to a fully automatic rewinder for continuous semiconductor chips. Background technique [0002] In the current semiconductor industry, semiconductor chips are packaged in tapes, and the tapes need to be wound into reels. However, the existing winding methods generally use manual winding, so the work efficiency is low and the production cost is high. Even if there is an existing winding mechanism, it is suitable for realizing winding chips, because the existing winding mechanisms all use winding rollers for winding, such as films; The method is to replace another material tray after winding one tray, so manual assistance is required, and it is impossible to realize full-automatic winding. Contents of the invention [0003] The purpose of the present invention is to provide a continuous semiconductor chip automatic feeding machine, which can automatically load ...

AI Technical Summary

Problems solved by technology

[0002] At present, in the semiconductor industry, semiconductor chips are packaged in tapes, and the tapes need to be wound into reels; while the existing winding methods generally use manual winding, so the work efficiency is low and the production cost is high.

Even if there is an existing winding mechanism, it is suitable for realizing winding chips, because the existing winding mechanisms all use winding rollers for winding, such as films; The method is to replace another reel after rewinding one reel, so manual assistance is required, and it is impossible to realize automatic rewinding

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