Device for measuring flatness of gluing developing trough in gluing developing machine and method thereof
A glue-coating developing and developing machine technology, applied in the direction of measuring devices, optical devices, instruments, etc., can solve the problems of large manual measurement errors, waste of labor, and long time consumption, so as to reduce test errors, solve large measurement errors, The effect of simple structure
Active Publication Date: 2019-02-22
SHANGHAI HUALI MICROELECTRONICS CORP
View PDF6 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] The invention provides a device for measuring the flatness of a glue-coated developing tank in a glue-coated developing machine, a method thereof, and its use in order to solve the problems of large manual measurement errors, long time consumption, and waste of labor in the existing method for measuring the flatness of silicon wafers. method
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0032] In the following, the present invention will be described in detail and specifically through specific examples, so as to better understand the present invention, but the following examples do not limit the scope of the present invention.
[0033] Embodiments of the present invention provide a device for measuring the flatness of the glue developing tank in the glue developing machine, such as figure 1 As shown, including the nozzle 1, the silicon wafer 2 is provided directly below the nozzle 1, and the lower end surface of the silicon wafer 2 is provided with a chuck 3, and the nozzle 1 is suspended directly above the silicon wafer 2 by a mechanical arm 4, and it is characterized in that, The mechanical arm 4 is connected with the horizontal telescopic connecting rod 6 through the vertical rotating shaft 5, the horizontal telescopic connecting rod 6 is arranged directly above the mechanical arm 4, and the two ends of the horizontal telescopic connecting rod 6 are respect...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a device for measuring the flatness of a gluing developing trough in a gluing developing machine and a method thereof. The device comprises a nozzle; and a chuck is arranged right below the nozzle and is used for placing a silicon wafer. A first distance sensor and a second distance sensor are respectively arranged at two ends of a horizontal telescopic connecting rod; thefirst distance sensor measures a vertical distance between one end of the horizontal telescopic connecting rod and the upper surface of the silicon wafer to obtain a first vertical distance and transmits the first vertical distance data to a remotely connected processing platform; the second distance sensor measures a vertical distance between the other end of the horizontal telescopic connectingrod and the upper surface of the silicon wafer to obtain a second vertical distance and transmits the second vertical distance data to the remotely connected processing platform; and the processing platform carries out calculation based on the first vertical distance and the second vertical distance to obtain an inclination angle of the silicon wafer. Therefore, a problem of large measuring errorof the manual level meter usage is solved. The device has a simple structure and is capable of realizing multi-point testing, so that the test error is reduced.
Description
technical field [0001] The invention relates to a device and a method for measuring flatness, in particular to a device and a method for measuring the flatness of a glue developing tank in a glue developing machine. Background technique [0002] Coating and developing machine is a common equipment for manufacturing semiconductors. It is generally used for photoresist coating and developing processes. The process of photoresist coating generally includes placing silicon wafers in the coating and developing machine. The photoresist is sprayed on the surface of the silicon wafer by the resist nozzle; the flatness of the surface of the silicon wafer needs to be checked and measured before use, and most of the methods currently used are measured by a level meter manually, and the specific steps are: put the standard silicon wafer Placed on the chuck, the level is artificially placed in the center of the silicon wafer, the level information measured by the level is transmitted to ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/30
CPCG01B11/30
Inventor 张涛王晓龙
Owner SHANGHAI HUALI MICROELECTRONICS CORP