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Wire polishing device

A technology of polishing device and polishing mechanism, which is applied in the direction of grinding/polishing equipment, grinding machines, and parts of grinding machine tools, etc., which can solve the problems of difficulty in ensuring the stability and consistency of the polishing process, wire scratches, and fast wear of wires and other issues, to improve the polishing efficiency and polishing quality, and reduce the effect of movement resistance

Active Publication Date: 2019-03-01
中科雷舜智能科技(宁波)有限公司
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Problems solved by technology

[0005] However, when the wire polishing machine of the above-mentioned special-shaped wire drawing die is in operation, because the mechanical reciprocating motion of the metal wire drives the abrasive grains or grinds for reciprocating grinding, the resistance to the wire is large, which makes the wire scratch seriously, making the metal The wire wears fast, so it is difficult to ensure the stability and consistency of the polishing process. It is also difficult to guarantee the shape and position accuracy of the corresponding wire drawing die hole. And the corresponding polishing time is long and the efficiency is low

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "or / and" includes any and all combinations of one or more of the ass...

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Abstract

The invention relates to a wire polishing device, which comprises a rotating fixing mechanism, a polishing mechanism and a moving bracket. The rotating fixing mechanism is used for fixing a wire-drawing die and can drive the wire-drawing die to rotate; the polishing mechanism comprises a metal wire penetrating through a die hole of the wire-drawing die, and two ultrasonic vibration generators arranged at the two ends of the metal wire correspondingly; vibration output parts of the two ultrasonic vibration generators and the metal wire are connected and fixed; and the two ends of the polishingmechanism are fixedly connected to the moving bracket, moving of the moving bracket drives the polishing mechanism to do reciprocating motion relative to the rotating fixing mechanism, and thus the wire-drawing die is polished. According to the wire polishing device, high-frequency ultrasonic vibration in the length direction of the metal wire is increased while the metal wire makes the reciprocating motion, the effect of reducing resistance of the metal wire is achieved, the metal wire also conducts high-frequency vibration to abrasive particles brought into a wire-drawing die hole sizing area, and thus the polishing efficiency and the polishing quality of the wire polishing device on the wire-drawing die are improved.

Description

technical field [0001] The invention belongs to the technical field related to polishing processing equipment, in particular to a line polishing device. Background technique [0002] A wire drawing die usually refers to a die used to draw various metal wires or optical fibers, wherein the center of the wire drawing die has a die hole of a certain shape, round, square, octagonal or other special shapes, and metal wires, optical fibers, etc. The wire is manufactured by passing through the die holes step by step from large to small, so that the size becomes smaller and even the shape changes. [0003] It can be understood that the die hole on the wire drawing die is initially processed by laser processing or EDM. In order to reduce the resistance of the wire drawing process and improve the surface quality of the metal wire, a polishing process is also required. At present, the polishing of the sizing area of ​​the upper die hole of the existing wire drawing die generally adopt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B5/48B24B41/00B24B1/04
CPCB24B1/04B24B5/48B24B41/00
Inventor 徐洪涛翟锰钢赵夙于磊张庆龙周瑜婷
Owner 中科雷舜智能科技(宁波)有限公司