Cutting fluid magnetic adsorption diamond wire saw cutting device

Abstract

The invention belongs to the technical field of diamond wire saw cutting, and in particular to a cutting fluid magnetic adsorption diamond wire saw cutting device. The device comprises a diamond saw wire, a rolling wheel, guide wheels and a nozzle, wherein the diamond saw wire is arranged on the outer side of a roller and the outer sides of the guide wheels in a closed annular shape and rotates ina single direction, and two guide wheels are arranged; one side of the diamond saw wire between the two guide wheels is provided with a to-be-cut workpiece, and the other side of the diamond saw wireis provided with a permanent magnet; and the nozzle is arranged on one side, which is cut by the diamond saw wire, of the workpiece, and the nano magnetic cutting fluid is sprayed out of the nozzle.According the device, the vaporific-shaped nano magnetic cutting fluid is sprayed out of the nozzle under the action of high-speed airflow, finally, cutting liquid drops are sprayed to the surface ofthe sawing wire, so that the using amount of the cutting fluid is reduced; and in the cutting area, more cutting fluid can be simultaneously contacted with the diamond saw wire and the workpiece to form lubricating layers, the cutting temperature caused by cutting force and friction in the cutting area is reduced, the slicing quality is improved, and the service life of the saw wire is prolonged.

Description

technical field [0001] The invention belongs to the technical field of diamond wire saw cutting, and in particular relates to a cutting fluid magnetic adsorption diamond wire saw cutting device. Background technique [0002] Diamond wire saw cutting is currently the mainstream cutting technology in the silicon wafer industry. During the cutting process of diamond wire saw, the purpose of material removal is achieved by direct contact between the diamond abrasive grains fixed on the saw wire and the workpiece, which belongs to the two-body cutting system. Compared with the free abrasive wire saw cutting technology, diamond wire saw cutting has the advantages of high cutting efficiency, high precision, easy recycling of cutting sawdust, and low environmental load. However, when cutting with a diamond wire saw, due to the narrow kerf, the cutting fluid cannot effectively enter the cutting area, and the cutting heat cannot be eliminated in time. After being absorbed by the wire...

AI Technical Summary

Problems solved by technology

However, when cutting with a diamond wire saw, due to the narrow kerf, the cutting fluid cannot effectively enter the cutting area, and the cutting heat cannot be eliminated in time. After being absorbed by the wire saw, it will cause the diamond abrasive grains to fall off and the wire to break. The particles are squeezed during the cutting process and embedded in the surface of the silicon wafer, resulting in deep pits, and the damage to the surface and sub-surface quality of the silicon wafer is more serious.

[0003] In view of the shortcoming that the cutting fluid cannot effectively enter the cutting area in diamond wire saw cutting, it is mainly improved by increasing the supply of cutting fluid

This is the method commonly used in enterprises at present, but the cutting fluid brought into the cutting area by the surface of the diamond saw wire is limited, and it is difficult to achieve a good lubricating and cooling effect

At the same time, it caused a serious waste of cutting fluid, and the cost of waste treatment in the later stage increased.

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