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Resin material and laminate

A technology of resin materials and adhesive resins, applied in the field of resin materials, can solve problems such as high cost, large difference in linear expansion coefficient, and poor processability

Active Publication Date: 2019-03-01
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the method using a ceramic substrate has problems such as difficulty in forming a multilayer structure, poor processability, and very high cost.
In addition, the difference in coefficient of linear expansion between the ceramic substrate and the copper circuit is large, so there is also a problem that the copper circuit is easy to peel off during cooling and heating cycles

Method used

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  • Resin material and laminate
  • Resin material and laminate
  • Resin material and laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～9 and comparative example 1～8

[0259] (1) Manufacture of resin materials

[0260] The ingredients shown in the following Tables 1 and 2 were mixed in the mixing amounts shown in the following Tables 1 and 2, and stirred at a speed of 500 rpm for 25 minutes using a planetary mixer to obtain a resin material.

[0261] (2) Manufacture of laminated body

[0262] The obtained resin material was coated on a release PET sheet (thickness 50 μm) so as to have a thickness of 350 μm, and dried in an oven at 90° C. for 10 minutes to form a curable sheet (insulating layer) to obtain a laminated sheet material. Thereafter, the release PET sheet was peeled off, both sides of the curable sheet (insulating layer) were sandwiched between copper foil and aluminum plate, and vacuum pressing was performed at a temperature of 200°C and a pressure of 12 MPa to manufacture a laminated body .

[0263] (Evaluation)

[0264] (1) thermal conductivity

[0265] The obtained laminate was cut into 1 cm squares, and carbon black was s...

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Abstract

A resin material is provided which can effectively improve insulation properties and thermal conductivity, can further effectively suppress variation in dielectric breakdown strength and can further effectively increase adhesion. This resin material contains first inorganic particles, second inorganic particles and a binder resin. The ratio of the compressive strength at 10% compression of the first inorganic particles to the compressive strength at 10% compression of the second inorganic particles is greater than or equal to 2.5. The compressive strength at 10% compression of the second inorganic particles is less than or equal to 1.5 N / mm<2>, and the aspect ratio of the primary particles constituting the second inorganic particles is less than or equal to 7.

Description

technical field [0001] The present invention relates to a resin material containing inorganic particles and a binder resin. Furthermore, the present invention relates to a laminate using the resin material. Background technique [0002] In recent years, the miniaturization and high performance of electronic and electrical equipment have gradually increased, and the mounting density of electronic components has increased. Therefore, how to dissipate heat generated by electronic components in a narrow space becomes a problem. The heat generated by electronic components is directly related to the reliability of electronic and electrical equipment, so effectively dissipating the generated heat is an urgent problem to be solved. [0003] As one of the methods for solving the above problems, there is a method of using a ceramic substrate having high thermal conductivity as a heat dissipation substrate for mounting power semiconductor devices and the like. Examples of the cerami...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00B32B27/18C01B21/064C08K3/38C08K7/00H01L23/373
CPCB32B27/18C08K3/38H01L23/373C08K2003/385C08K2201/016C08K2201/001C08K2201/014C08L63/00C08K3/013C08K7/24C01B21/064C08J5/18C08L101/00B32B15/092B32B15/20B32B27/20B32B27/26B32B27/38B32B2264/107B32B2307/302B32B2307/304H01L23/3735C08K2201/003
Inventor 川原悠子大鹫圭吾足羽刚儿杉本匡隆
Owner SEKISUI CHEM CO LTD
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