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Laser annealing apparatus and sheet resistance calculation apparatus

A technology of surface resistance and laser annealing, which is applied in the direction of measuring devices, circuits, measuring electronics, etc., can solve problems such as time-consuming and labor-intensive damage to semiconductor wafers

Active Publication Date: 2019-03-05
SUMITOMO HEAVY IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the measurement of surface resistance becomes an offline operation, which is time-consuming and labor-intensive.
Also, since the probes must be brought into contact with the semiconductor wafer, the semiconductor wafer can be damaged

Method used

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  • Laser annealing apparatus and sheet resistance calculation apparatus
  • Laser annealing apparatus and sheet resistance calculation apparatus
  • Laser annealing apparatus and sheet resistance calculation apparatus

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Embodiment Construction

[0022] Below, refer to Figure 1 ~ Figure 5C , the laser annealing apparatus based on the embodiment will be described.

[0023] figure 1 It is a schematic diagram of the laser annealing apparatus based on an Example. The laser annealing device based on the embodiment includes a laser optical system 10 , a chamber 30 , an infrared detector 20 , a processing device 40 , a storage device 41 , an output device 42 and an input device 43 .

[0024] The laser optical system 10 includes a laser light source 11 , a homogenizing optical system 12 and a turning mirror 13 . The laser light source 11 outputs a laser beam in an infrared region. As the laser light source 11, for example, a laser diode with an oscillation wavelength of 808 nm can be used. The homogenizing optical system 12 homogenizes the beam distribution of the laser beam output from the laser light source 11 . The turning mirror 13 reflects the laser beam passing through the homogenizing optical system 12 downward. ...

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Abstract

Provided is a laser annealing apparatus capable of reducing time and labor for measuring a sheet resistance and measuring the sheet resistance in a non-contact manner. A laser beam from a laser optical system is incident onto a semiconductor wafer. Thermal radiation light from the semiconductor wafer is incident onto an infrared detector. The infrared detector outputs a signal based on the intensity of the thermal radiation light. A processing device calculates a sheet resistance of the semiconductor wafer that is annealed by the laser beam on the basis of an output value of the infrared detector, and outputs a calculation value of the sheet resistance to an output device.

Description

[0001] This application claims priority based on Japanese Patent Application No. 2017-170504 filed on September 5, 2017. The entire contents of this Japanese application are incorporated herein by reference. technical field [0002] The invention relates to a laser annealing device and a surface resistance calculation device. Background technique [0003] Conventionally, sheet resistance has been measured as an example of a method for grasping the in-plane distribution of the activation state of a semiconductor wafer implanted with a dopant and subjected to activation annealing. The activation state of the dopant can be evaluated from the in-plane distribution of the surface resistance. [0004] Patent Document 1: Japanese Patent Laid-Open No. 2007-81348 [0005] Generally, a four-probe method is used in the measurement of surface resistance. The measurement of surface resistance using the four-probe method was performed after annealing in a device different from the acti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/66
CPCH01L21/67115H01L22/14H01L22/20G01J5/20G01R31/2831H01L21/268H01L21/324
Inventor 田中哲平
Owner SUMITOMO HEAVY IND LTD
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