LED chip with solder electrode, and manufacturing method of LED chip

Abstract

The invention discloses an LED chip with a solder electrode. The LED chip comprises a substrate, a light emitting structure arranged on the substrate and comprising a first semiconductor layer, an active layer, a second semiconductor layer, a reflecting layer and a first insulating layer which are sequentially arranged on the substrate, a first metal layer arranged on the surface of the first insulating layer, a second insulating layer arranged on the first metal layer and in an isolation groove, a second metal layer arranged on the second insulating layer, and a solder metal layer which penetrates through the second metal layer and the second insulating layer and is connected with a first electrode and a second electrode, wherein the wettability of the first metal layer is larger than thewettability of the second metal layer. Accordingly, the invention further provides a manufacturing method for the LED chip with the solder electrode. The solder metal layer is agglomerated on the first metal layer, and secondary production is performed, so that the thickness of the solder metal layer is increased.

Description

technical field [0001] The invention relates to the technical field of light emitting diodes, in particular to an LED chip with solder electrodes and a manufacturing method thereof. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) is a semiconductor device that uses carrier recombination to release energy to form light. LED chips have low power consumption, pure chromaticity, long life, small size, fast response time, energy saving and environmental protection, etc. Many advantages. [0003] Compared with front-mounted LED chips, flip-chip LED chips have many advantages such as uniform current distribution, good heat dissipation, lower voltage, and high efficiency. Therefore, after the flip-chip LED chip was proposed, it quickly received widespread attention and made a series of progress. However, compared with the formal LED chip, the flip-chip LED chip needs to be soldered with solder paste on the position where the chip is welded on the sub...

AI Technical Summary

Problems solved by technology

[0004] However, this way of dispensing solder paste cannot accurately control the amount of solder paste. If the amount of solder paste is too small, it will easily lead to poor soldering and increased voids, which will lead to high VF of the chip and aging failure; too much solder paste will lead to chip failure. Position drift is prone to occur during the soldering process, which affects the yield of package soldering

[0005] Existing flip-chip LED chips can obtain a uniform thickness of solder layer metal by depositing metal after photolithographic patterning on the chip surface, but because the thickness of the existing negative photoresist is often within 5 μm, resulting in solder layer metal The thickness can only be deposited within 5μm, otherwise the subsequent patterning process will not be possible

However, the solder layer metal within 5 μm cannot meet the requirements of eutectic soldering. It is necessary to further increase the thickness of the solder layer on the chip to ensure the elimination of soldering voids and ensure the yield and stability of the package.

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