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Packaging Structure and Packaging Devices

A packaging structure and packaging technology, which is applied in the manufacture of semiconductor devices, electric solid-state devices, and semiconductor/solid-state devices, etc., can solve the problems of easy entry of water and oxygen into the interior of the packaging device, easy rupture of the packaging structure film, and separation of the film. It can enhance the ability to block water and oxygen, reduce the possibility of film peeling off, and enhance the bonding force.

Active Publication Date: 2020-11-10
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The application provides a packaging structure and a packaging device, which can solve the problems in the prior art that the film layers of the packaging structure are easily broken, so that the film layers are separated and water and oxygen are easy to enter the inside of the packaging device.

Method used

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  • Packaging Structure and Packaging Devices
  • Packaging Structure and Packaging Devices
  • Packaging Structure and Packaging Devices

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Embodiment Construction

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0015] The terms "first", "second", and "third" in this application are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least t...

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Abstract

The present application discloses a packaging structure and a packaging device. The packaging structure includes: a base layer, one side of the base layer is used to form a part to be packaged; a first packaging layer is formed on a side of the part to be packaged facing away from the base layer, And cover the side wall of the component to be packaged; the first buffer layer is arranged around the periphery of the first packaging layer and pasted on the side wall of the first packaging layer; the second packaging layer is formed on a side of the first packaging layer facing away from the base layer side, and cover the sidewall of the first buffer layer. Through the above method, the present application can enhance the bonding force between the film layers, reduce the possibility of the film layer falling off and enhance the ability of the packaging device to block water and oxygen, so as to realize the seamless bonding between the film layers.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a packaging structure and a packaging device. Background technique [0002] Organic Light-Emitting Diode (OLED) is a new display and lighting technology with self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, wide operating temperature range, and It realizes many advantages such as flexible display and large-area full-color display, and is recognized by the industry as a display device with the most development potential. [0003] OLED devices are very sensitive to oxygen and water vapor, and water and oxygen penetrating into the device will seriously affect the luminous efficiency of the device and reduce the luminous lifetime of the device. And the packaging device 100 of the OLED device in the prior art is as figure 1 As shown, it includes a first inorganic layer 110 , an organic layer 120 , a secon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/50H01L51/52
CPCH10K50/00H10K50/84
Inventor 张轩周诗丽牛元帝朱声建
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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