Glass sintered elastic connector

Abstract

The invention discloses a glass sintered elastic connector. The glass sintered elastic connector comprises a shell, an insulation medium, a first internal conductor, a spring, a glass insulator and asecond internal conductor, wherein the second internal conductor is connected to the glass insulator, the glass insulator is connected to the spring, the spring is connected with the first internal conductor, the first internal conductor is connected to the insulation medium, the insulation medium is connected to the shell, the shell is in a circular shape, an inner hole is formed in the shell, the diameter of the inner hole of the shell is equal to the external diameter of the insulation medium, the insulation medium is in a cylindrical shape, a penetrating round hole is formed in the centerof the insulation medium, the external diameter of the first internal conductor is equal to the diameter of the central round hole of the insulation medium, the interior of the first internal conductor is in a hollow shape, the diameter of the spring is same as a part of the diameter of the internal hollow part of the first internal conductor, a round hole is formed in the glass insulator, and theexternal diameter of the second internal conductor is same as the diameter of the round hole of the glass insulator.

Description

technical field [0001] The invention relates to the field of communication equipment, in particular to a glass sintered elastic connector. Background technique [0002] With the development of microwave technology, the volume of related components is getting smaller and higher, and the application of board-to-board, modularization and vertical interconnection is getting more and more attention. It has been unable to meet the needs of this miniaturization. Whether it is the early N, TNC, SMA, 2.92 series products, or the darlings of the new era, SMP and SSMP, they all seem unable to do what they want. The market desperately needs a small size, high frequency of use, and can adapt to Connectors for board-to-board mating and vertical interconnection. [0003] The main disadvantages of the prior art are as follows: Firstly, the interface types of the old series of products such as N, SMA, TNC, and 2.92 products are all threaded connections, which are destined not to be miniatur...

AI Technical Summary

Problems solved by technology

[0002] With the development of microwave technology, the volume of related components is getting smaller and higher, and the application of board-to-board, modularization and vertical interconnection is getting more and more attention. It has been unable to meet the needs of this miniaturization. Whether it is the early N, TNC, SMA, 2.92 series products, or the darlings of the new era, SMP and SSMP, they all seem unable to do what they want. The market desperately needs a small size, high frequency of use, and can adapt to Connectors for board-to-board mating and vertical interconnection

[0003] The main disadvantages of the prior art are as follows: Firstly, the interface types of the old series of products such as N, SMA, TNC, and 2.92 products are all threaded connections, which are destined not to be miniaturized and modularized, because in any case, there must be room for manual screwing. Nut space, while BNC, MCX, and SMB products are quick-plug products, but their low frequency of use is flawed (up to 6GHz) and cannot be modularized. They can only be plugged one by one, and cannot Vertical interconnection. At present, there are only two types of products on the market that can achieve modularity, high frequency band, and small enough size. However, these two products have complex structures, high processing costs, and must be used in pairs. Adding SMP-KK type adapters in the middle for transition requires high structural and dimensional accuracy of the PCB board, and the volume is also larger

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