An organic light emitting display panel and an organic light emitting display device
A light-emitting display, organic technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of electrostatic damage in the packaging area, increase the electrostatic discharge path of the packaging area of the organic light-emitting display panel, etc., to improve the static electricity The effect of releasing capacity, increasing electrostatic discharge path, and improving reliability
Active Publication Date: 2021-03-05
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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Problems solved by technology
[0005] Embodiments of the present invention provide an organic light-emitting display panel and an organic light-emitting display device, which can increase the electrostatic discharge path in the packaging area of the organic light-emitting display panel by arranging the first metal part and the second metal part connected to the first potential, and solve the problem of The packaging area of organic light-emitting display panels is prone to electrostatic damage
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[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0026] Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a", "said" and "the" are also intended to include the plural forms unless th...
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Embodiments of the present invention provide a display panel and a display device including the display panel. The display panel and the display device provided by the embodiments of the present invention include a base substrate, an opposite substrate, a first metal portion disposed on the base substrate, a second metal portion disposed on the opposite substrate, and a first metal portion disposed on the first metal portion and the second metal portion. Encapsulation material between two metal parts. Both the first metal part and the second metal part are located between the base substrate and the opposite substrate, and the first metal part and the second metal part are connected to a first potential. The second metal part includes a plurality of second hollow parts overlapping with the first metal part, and / or the first metal part includes a plurality of first hollow parts overlapping with the second metal part. The display panel and the display device provided by the embodiments of the present invention increase the electrostatic discharge path in the packaging area, solve the problem of electrostatic damage in the packaging area, and improve the reliability of the display panel and the display device.
Description
technical field [0001] The present invention relates to the display field, in particular to an organic light emitting display panel and an organic light emitting display device. Background technique [0002] In display technology, Organic Light Emitting Diode (OLED) is recognized by the industry for its thinness, active light emission, fast response speed, wide viewing angle, rich colors and high brightness, low power consumption, and high and low temperature resistance. It is the third generation of display technology after Liquid Crystal Display (LCD). [0003] In the prior art, the encapsulation of organic light-emitting display panels is divided into two types: glass frit fusion encapsulation and film encapsulation. Glass powder fusion packaging refers to adding glass powder between the upper substrate and the lower substrate of the organic light-emitting display panel, and using laser light to irradiate the glass powder to make it into a molten state, so that the upper...
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IPC IPC(8): H01L27/32H01L51/52H01L23/60
CPCH01L23/60H10K59/40H10K59/131H10K50/8426
Inventor 熊志勇刘海民朱鹏娟
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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