High-performance waterproof sealing ring and manufacturing process thereof

Abstract

The invention discloses a high-performance waterproof sealing ring and a manufacturing process thereof and belongs to the field of sealing ring making. The high-performance waterproof sealing ring comprises a gyro sealing ring body arranged on a PIN needle. The manufacturing process comprises the steps that firstly, preparing is carried, and specifically, the lower end of the PIN pin is verticallyfixed to the inside bottom end of a mould, and a connecting ring is clamped to the end, away from the bottom end of the mould, of the PIN needle; secondly, a first mould-closing injection is carriedout, and specifically, the inside of the mould is subjected to injection from the upper side of the mould; thirdly, a first mould opening is carried out, and specifically, the mould is adjusted, the connecting ring is removed, and a double-headed block is connected between a fixed mould and a moving mould; fourthly, a second mould-closing injection is carried out, and specifically, the inside of the mould is subjected to injection from the upper side of the mould again; and fifthly, a second mould opening is carried out, and the corners of excess sealing materials are removed. According to themanufacturing process, the sealing ring can be integrally synthesized on the injection moulding block and the PIN needle, has good sealing property, can effectively block the penetration of moisture,and protect the PIN needle and the internal components of charging joints.

Description

technical field [0001] The invention relates to the field of sealing ring production, more specifically, to a high-performance waterproof sealing ring and its manufacturing process. Background technique [0002] At present, there are mainly two types of connection and packaging methods for circuit boards and chips in electronic components such as automotive sensors and electronic actuators: injection molding and assembly. The injection molding packaging method is to connect the circuit board, the chip and the PIN pin or the wiring harness including the connector together and fix them on the primary injection molding block to form a primary injection molding component, and then form a complete electronic product through secondary injection molding. [0003] Due to the high pressure and high temperature of the secondary injection molding in this molding method, it is difficult to securely fix the circuit board, chip, PIN needle or wire harness on the primary injection molding ...

AI Technical Summary

Problems solved by technology

[0003] Due to the high pressure and high temperature of the secondary injection molding in this molding method, it is difficult to securely fix the circuit board, chip, PIN needle or wire harness on the primary injection molding block, resulting in poor sealing after the PIN needle assembly. At this time, a sealing ring can be used Auxiliary sealing is carried out to ensure its sealing performance, but the existing sealing ring has poor waterproof performance. Once it encounters water seepage, it will damage the root of the PIN needle and the internal components of the charging connector.

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