Unlock instant, AI-driven research and patent intelligence for your innovation.

Thermal conductive silicone rubber with multilayer structure and application of thermal conductive silicone rubber

A heat-conducting silicone rubber and multi-layer structure technology, applied in the field of heat-conducting silicone rubber, can solve the problems of poor mechanical strength of heat-conducting products, high surface viscosity of products, and inability to complete molding, etc., to achieve smooth and rapid distribution, easy demoulding, and scientific heat dissipation Effect

Pending Publication Date: 2019-03-22
KUSN ZHONGDI MATERIALS TECH
View PDF2 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, products with low hardness and high thermal conductivity have poor mechanical strength and high viscosity on the surface of the product. The uneven parts are easy to stick to the mold during molding and cannot be completely formed.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermal conductive silicone rubber with multilayer structure and application of thermal conductive silicone rubber
  • Thermal conductive silicone rubber with multilayer structure and application of thermal conductive silicone rubber
  • Thermal conductive silicone rubber with multilayer structure and application of thermal conductive silicone rubber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0072] As a preferred embodiment of the present invention, the first adhesive film layer and the second adhesive film layer both include the following raw materials in parts by weight: 80-95 parts of hot melt adhesive and 5-20 parts of boron nitride;

[0073] Preferably, both the first adhesive film layer and the second adhesive film layer include the following raw materials in parts by weight: 85-90 parts of hot melt adhesive and 10-15 parts of boron nitride.

[0074] By limiting the specific raw material composition and amount of the first adhesive film layer and the second adhesive film layer, the first adhesive film layer and the second adhesive film layer have better performance.

[0075] As a preferred embodiment of the present invention, the intermediate layer includes the following raw materials in parts by weight: 10-15 parts by weight of liquid silicone rubber, 50-85 parts of alumina, 1-5 parts of boron nitride, and 0.05-0.1 parts of coupling agent , 0.05-0.1 parts of plati...

Embodiment 1

[0086] The thermally conductive silicone rubber with a multilayer structure provided in this embodiment includes a first adhesive film layer, a second adhesive film layer, and an intermediate layer located between the first adhesive film layer and the second adhesive film layer;

[0087] The materials of the first adhesive film layer and the second adhesive film layer are the same, and the following parts by weight are used: 85 parts of hot melt adhesive and 15 parts of boron nitride; among them, the first adhesive film layer and the second adhesive film layer The thickness is 15 μm, the hardness is A30, the elongation at break is 410%, and the particle size D50 of boron nitride is 10 μm.

[0088] The middle layer is made of heat-conducting material. The middle layer includes the following raw materials by weight: 10 parts by weight of liquid silicone rubber, 60 parts of alumina, 5 parts of boron nitride, 0.05 parts of coupling agent, 0.05 parts of platinum catalyst and 0.01 parts o...

Embodiment 2

[0091] The multilayer structure thermally conductive silicone rubber provided in this embodiment, except for the first adhesive film layer and the second adhesive film layer, are made of 95 parts by weight of hot melt adhesive and 5 parts by weight of boron nitride. Otherwise, the rest of the structure and composition are the same as in Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
melting pointaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention provides thermal conductive silicone rubber with a multilayer structure and application of the thermal conductive silicone rubber, and relates to the technical field of the thermal conductive silicone rubber. The thermal conductive silicone rubber comprises a first rubber film layer, a second rubber film layer, and a middle layer positioned between the first rubber film layer and thesecond rubber film layer; by arranging the first rubber film layer and the second rubber film layer on the upper surface and the lower surface of the middle layer, all the layers can be compounded into the thermal conductive silicone rubber with the multilayer structure, namely a stepped structure; by use of the thermal conductive silicone rubber with the multilayer structure, a thermal conductive board can be well tightly laminated with a chip with a stepped structure, heat between the thermal conductive board and the chip favorably, smooth and quickly dissipates out, and the technical problems that because an existing conventional heat-conducting gasket cannot be produced into a fine structure, the chip is difficultly and tightly laminated with the thermal conductive board and the heatbetween the chop and the thermal conductive board does not favorably dissipate are solved. The invention further provides application of the thermal conductive silicone rubber with the multilayer structure in electronic parts and components.

Description

Technical field [0001] The invention relates to the technical field of thermally conductive silicone rubber, in particular to a multi-layer structure thermally conductive silicone rubber and its application. Background technique [0002] With the development of microelectronics and large-scale integrated circuits, the packaging density of electronic components continues to increase, and the heat dissipation of electronic components has become one of the most critical issues in design. If the heat conduction problem of electronic components is not solved well, it will directly affect the normal use and life of various electronic devices. In order to solve the heat dissipation problem of heating electronic components, thermally conductive gaskets, as a typical thermal interface material, can significantly reduce the thermal resistance caused by contact gaps and improve the heat dissipation effect. In the field of heat dissipation of electronic devices, such as the bonding of chips ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/20C09J7/35C08L83/04C08K3/22C08K3/38C09J11/04C09J201/00H05K7/20
CPCH05K7/2039C09J7/20C09J7/35C09J11/04C09J201/00C08K3/22C08K3/38C08K2003/385C08K2003/2227C09J2483/006C08L83/04
Inventor 金天辉许进刘伟德
Owner KUSN ZHONGDI MATERIALS TECH