Novel vehicle diode frame
A diode and a new type of technology, applied in the field of new automotive diode frames, can solve the problems of large external stress on the chip and lower yield rate, and achieve the effect of improving the service life and reducing the damage rate.
Pending Publication Date: 2019-03-22
SEMI CONDUCTOR RES INST SHANDONG
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Problems solved by technology
[0003] As the area of the diode chip increases, the external stress on the chip after the diode is packaged becomes larger and larger, and the yield rate decreases.
Method used
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Embodiment 1
[0023] Example 1, such as figure 1 As shown, the present invention provides a novel automotive diode frame, comprising a square copper seat, a chip layer is arranged on the top of the square copper seat, and the chip layer includes a soldering sheet layer, a circular OJ chip, and a soldering sheet successively from bottom to top. Layer, circular copper particle layer, solder sheet layer and new external leads, the circular OJ chip is an OJ double-sided nickel-plated chip, the purpose of setting the circular copper particle layer here is to make a good connection between the chip and the lead. The buffer, and the design of the new external lead is to achieve a buffer between the lead and the circular copper grain layer.
[0024] Such as figure 2 and image 3 As shown, the new type of external lead includes a new type of key plate arranged on the upper part of the solder sheet layer. One end of the new key type plate is provided with a bar-shaped connecting plate, and the end...
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The invention belongs to the field of vehicle diodes, and relates to a novel vehicle diode frame. The diode frame comprises a square copper seat. The upper part of the square copper seat is provided with a chip layer, and the chip layer includes a soldering flake layer, a circular OJ chip, a soldering flake layer, a round copper particle layer, a soldering flake layer, and a novel external lead insequence from bottom to top. The novel external lead includes a novel key plate disposed on the upper part of the soldering flake layer. One end of the novel key plate is provided with a strip connecting plate. One end of the strip connecting plate, far away from the novel key plate, is provided with an L-shaped connecting plate. One end of the L-shaped connecting plate, far away from the strip connecting plate, is provided with a pin plate. The middle part of the novel key plate is provided with a key type through cavity, and the key type through cavity is internally provided with an X-shaped elastic plate. The outer side of the X-shaped elastic plate is provided with a package elastic rubber disposed in the key type through cavity. After black plastic molding of the diode frame, yield of the diode frame is increased from 90% to over 97%, thermal resistance is reduced from 50 to 60 mv to 30 to 40 mv, and high-temperature leakage at temperature of 120 degrees is reduced to less than 20 ua.
Description
technical field [0001] The invention belongs to the field of vehicle diodes, in particular to a novel vehicle diode frame. Background technique [0002] Transient Voltage Suppressor (TVS) for short, is a high-efficiency protection device in the form of a diode. When the two poles of the TVS diode are impacted by reverse transient high energy, it can change the high impedance between its two poles to low impedance at a speed of 10 minus 12 seconds, absorbing surge power up to several thousand watts , so that the voltage between the two poles is clamped at a predetermined value, effectively protecting the precision components in the electronic circuit from being damaged by various surge pulses. [0003] As the area of the diode chip increases, the external stress on the chip after the diode is packaged becomes larger and larger, and the yield rate decreases. The existing structure is that the chip is welded to the copper seat, a lead wire on the chip is directly connected ...
Claims
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IPC IPC(8): H01L23/495H01L29/861
CPCH01L29/861H01L23/49503H01L23/49541H01L2224/40245
Inventor 崔振华李志峰庄明虔
Owner SEMI CONDUCTOR RES INST SHANDONG