Reliability evaluation multilayer circuit board

A multi-layer circuit and reliability technology, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of inability to test and judge product reliability, affect product performance, and lack of uniformity, and achieve low manufacturing cost, Capacity mastery, obvious effect

Pending Publication Date: 2019-03-22
DALIAN CHONGDA CIRCUIT
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the reliability testing process of circuit board products is very complicated, and the process methods are also in different styles, but there is no unified standard. The test is carried out by technicians according to their own experience, level, professional knowledge, etc. Due to different methods

Method used

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  • Reliability evaluation multilayer circuit board
  • Reliability evaluation multilayer circuit board
  • Reliability evaluation multilayer circuit board

Examples

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Example Embodiment

[0021] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0022] It should be noted that in the following specific embodiments, when the embodiments of the present invention are described in detail, in order to clearly show the structure of the present invention for ease of description, the structure in the drawings is not drawn according to the general scale. Partial enlargement, deformation, and simplification of processing have been implemented. Therefore, this should be avoided as a limitation of the present invention.

[0023] The more important reliability evaluation includes the material test of the circuit board base material, the circuit reliability and mechanical performance reliability of the processed circuit board under extreme environments, and the circuit board base material and circuit board processing parameters match each other. The reliability of the finished circuit board is ...

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Abstract

The invention discloses a reliability evaluation multilayer circuit board. The reliability evaluation multilayer circuit board comprises a plurality of test regions; each test region comprises a drilled area and a hole wall state test area; the test holes of the drilled areas of the different test regions have different apertures; each drilled area includes a test hole array of the same aperture machined by the same drill bit; the inner wall of the test hole is provided with a conductive layer and a protective layer distributed sequentially from inside to outside; test lines which are arrangedbetween different layers of the multilayer circuit board and at the outer layers of the multilayer circuit board and are located between the test holes are connected in series so as to form a conductive test line; the outer circuit board of the drilled area is further provided with two connectivity test pads which are connected to the test holes corresponding to the start end and tail end of theconductive test line through a wire; and each hole wall state test area includes hole wall state test holes which are machined in the hole wall state test area by the same bit for machining the test holes after a certain number of test holes from the first test hole which are machined by the bit. With the reliability evaluation multilayer circuit board of the invention adopted, the reliability ofproducts can be judged scientifically and accurately.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a reliability evaluation multilayer circuit board. Background technique [0002] The effective carrier of circuit boards as electronic components has always been hailed as the aircraft carrier of electronic components. It is the key core component of modern electronic equipment and products, and it is a strong support for the rapid development of modern technology. , high efficiency, and reliability have a huge role and influence, especially in the fields of aviation, aerospace, military industry, automobiles, shipbuilding, and power generation. Therefore, people use various technical means to ensure that circuit boards are efficient, high-speed, High-quality, low-cost production has become an important research topic and activity content. [0003] Reliability refers to the ability or possibility of components, products, and systems to perform specified functions without fa...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0266H05K1/0298H05K3/0047H05K2201/096
Inventor 纪龙江郑威
Owner DALIAN CHONGDA CIRCUIT
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