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Release liquid injection tooling for encapsulating high-voltage IGBT modules

A tooling and high-voltage technology, applied in the field of release fluid injection tooling for high-voltage IGBT module packaging, can solve the problems of injection and release fluid that has not yet appeared, and achieve the effect of reducing time, reducing technical level and experience, and improving product quality.

Pending Publication Date: 2019-03-26
XIAN YONGDIAN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, up to now, there have been no reports on release liquid injection technology suitable for packaging high-voltage IGBT modules above 4500V

Method used

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  • Release liquid injection tooling for encapsulating high-voltage IGBT modules
  • Release liquid injection tooling for encapsulating high-voltage IGBT modules
  • Release liquid injection tooling for encapsulating high-voltage IGBT modules

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Experimental program
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Embodiment Construction

[0017] The invention discloses a release liquid injection tool for packaging high-voltage IGBT modules above 4500V, such as figure 1 , figure 2 and image 3 As shown, the injection tooling includes four parts: the bottom plate 1, the card seat 2, the buckle 3 and the support rod, wherein the support rod includes a vertical support rod 41 and a horizontal support rod 42, and the vertical support rod 41 is connected with the horizontal support rod. The rods 42 are connected by buckles 3, the vertical support rods 41 are connected with the bottom plate 1 by the clamp 2, and the horizontal support rods 42 are installed with a glue injection head and a glue suction head of the release liquid injection device. It should be noted that the release liquid injection equipment is an existing, conventional, and commercially available equipment.

[0018] As a preferred technical solution, the bottom plate 1 is a hard plate. The present invention has no strict requirements on the materia...

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PUM

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Abstract

The invention provides a release liquid injection tooling for encapsulating above-4500V high-voltage IGBT modules, which comprises a bottom plate, clamp seats, buckles and support rods. Each support rod consists of a vertical support rod and a horizontal support rod. The vertical support rods and the horizontal support rods are connected by the buckles. The vertical support rods and the bottom plate are connected by the clamp seats. A glue injection head and a glue absorption head of release liquid injection equipment are installed on the horizontal support rods. The injection tooling is suitable for encapsulating above-4500V high-voltage IGBT modules. By using the injection tooling, the difficulty of release liquid injection in the traditional high-voltage IGBT module encapsulation process can be greatly reduced, and the requirement for the technical level and experience of operators can be greatly lowered. Moreover, operators who lack experience can get started as soon as possible, the quality of release liquid injection can be significantly improved, and the time for release liquid injection can be reduced.

Description

technical field [0001] The invention belongs to the technical field of IGBT packaging, and in particular relates to a release liquid injection tool for high-voltage IGBT module packaging. Background technique [0002] The new power semiconductor device module represented by IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor) is currently the fastest-growing and most widely used power semiconductor device module in the world. As the core device of power electronics energy-saving technology, IGBT devices It has been widely used in inverters, electric welding machines, switching power supplies, air conditioners and rail vehicle electric drive systems. [0003] Especially for the high-voltage (4500V and above) IGBT modules used in rail transit systems, their quality and reliability directly affect the stability of the electric drive system of rail vehicles; and in the packaging of high-voltage IGBTs, there is a process of injecting and releasing liquid. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67126
Inventor 谢龙飞叶娜于凯
Owner XIAN YONGDIAN ELECTRIC
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