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Aluminum substrate processing technology

A processing technology, aluminum substrate technology, applied in the direction of electrical components, printed circuit manufacturing, electrical components, etc., can solve problems such as waste, increased labor costs, material cost waste, etc., to reduce raw material costs, avoid redundant waste, double cost reduction Effect

Inactive Publication Date: 2019-03-29
XIAMEN YANKON ENERGETIC LIGHTING CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such a reserved process edge causes unnecessary waste of materials in the entire production process, resulting in a waste of material cost, and in the actual production process, an additional manual process of breaking the board is required to replace the reserved process edge. Breaking off adds another labor cost to the production cost, so how to save the production cost of this link has become a problem that every manufacturer wants to solve

Method used

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  • Aluminum substrate processing technology
  • Aluminum substrate processing technology
  • Aluminum substrate processing technology

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0022] A kind of aluminum substrate processing technology is characterized in that comprising the following steps:

[0023] 1) Press the heat-conducting material and copper foil 3 onto the aluminum plate to form a first plate, and cut the first plate into plate units without process edges according to different imposition requirements. In this embodiment, the imposition requirements are not The sheet material unit is required to have a process edge, so the sheet material unit has no process edge setting; there are multiple single-piece aluminum substrates on the sheet material unit; the copper foil 3 is the circuit layer;

[0024] 2) Baking the above-mentioned sheet material unit at a certain temperature for a certain period of time to eliminate the internal stress of the sheet material unit during the production process and absorb the moisture...

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Abstract

The invention provides an aluminum substrate processing technology. The aluminum substrate processing technology comprises steps that a heat conductive material and a copper foil are pressed on an aluminum plate to form a first sheet material, and the first sheet material is cut into a sheet unit without process edges according to different imposition requirements; the sheet unit has multiple single aluminum substrates; the sheet unit is baked at a certain temperature for the certain time to eliminate the internal stress of the sheet unit in the manufacturing process, and the moisture of the sheet unit is absorbed; the number of positioning holes is determined according to the number of the single aluminum substrates; the positioning holes are disposed on the position of the sheet unit without the single aluminum substrates. The technology is advantaged in that under the premise of not affecting normal production, the step of reserving the process edges is omitted, and production costof products is saved.

Description

technical field [0001] The invention relates to the field of aluminum substrate manufacturing technology, in particular to an aluminum substrate processing technology. Background technique [0002] Chip mounters are widely used in the LED industry to meet the flexible production requirements of the LED lighting industry. However, due to the transmission track, the original aluminum substrate or printed board has a process edge in the early stage of production, which is to prevent When the placement machine is mounting components, the aluminum substrate hits the transmission track and causes the position to shift. However, such a reserved process edge causes unnecessary waste of materials in the entire production process, resulting in a waste of material cost, and in the actual production process, an additional manual process of breaking the board is required to replace the reserved process edge. Breaking off adds another labor cost to the production cost, so how to save the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K13/00
Inventor 张金凯雷鹏李方留郭远腾黄艺博
Owner XIAMEN YANKON ENERGETIC LIGHTING CO LTD
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