Heat dissipating device and application thereof

Abstract

The invention discloses a heat dissipating device and an application thereof, and belongs to the technical field of small space heat dissipation. The device comprises a cover plate, a bottom plate anda jet orifice plate between the cover plate and the bottom plate. The cover plate and the jet orifice plate form a first cavity. The bottom plate and the jet orifice plate form a second cavity. The cover plate is provided with a working medium inlet. The position of the bottom plate, far away from the working medium inlet, is provided with a working medium outlet. The jet orifice plate is provided with an array of jet holes. The bottom plate is provided with an array of fins. The fin and a vertical plane where a connecting line of the working medium inlet and the working medium outlet is in do not have an angle of 90 DEG, the angles of the fins in the same row are acute angles or obtuse angles, and the angles of the fins in adjacent two rows are respecitvley an obtuse angle and an acute angle. The device strengthens disturbance between the working mediums and improves heat exchange efficiency.

Description

technical field [0001] The invention relates to a heat dissipation device and its application, and belongs to the technical field of heat dissipation in small spaces. Background technique [0002] With the rapid development of electronic technology, the increase of power and the decrease of volume make the calorific value per unit area increase sharply, and the reliability of electronic equipment will decrease with the increase of temperature. A key link in technological development. In addition, in the field of microwave and laser, due to the continuous increase in the demand for working power and the low efficiency of microwave and laser systems, a large amount of waste heat needs to be dissipated, otherwise the accumulation of heat will lead to equipment damage. At the same time, due to the high degree of integration in electronic equipment and microwave and laser systems, the space for heat dissipation is narrow, which puts forward very high requirements for heat dissip...

AI Technical Summary

Problems solved by technology

Due to the gradual thickening of the thermal boundary layer along the flow direction of the working medium in the microchannel radiator, the temperature of the working medium will gradually rise, which will lead to the deterioration of the heat transfer effect near the outlet of the working medium; while the jet cooling device has a large flow resistance and a position outside the stagnation point of the jet flow. The disadvantage of rapid deterioration of the heat transfer effect

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