Wire guiding machine for bonding wire production

Abstract

The invention discloses a wire guiding machine for bonding wire production. The wire guide machine comprises a worktable, a groove, a sliding groove, a controller, a power supply interface, supportingfeet, a mounting plate, a main guiding roller, a first rotating piece, a small guiding roller, an auxiliary guiding roller and an efficient wire guiding device. A fixing device is arranged at the front end of a winding disc, a user takes down the fixing disc at the front end of the winding disc and then mounts a bonding wire barrel to a rotating shaft on the winding disc, then the winding disc iscovered with the fixing disc, the winding disc is likely to shake in the rotating process, thus fixity is poor, at the moment, the fixing device is mounted at the front end of the fixing disc, the user drives fixing rods through a rotary handle, thus a fixed plate can be fixed to a disc body stably, then tools are inserted into locking devices to screw the fixed plate, finally, the rotating shafton the winding disc can be fixed closely by clamping teeth in a clamping disc, convenience and rapidness are achieved, fixing work is completed, and the problem that the winding disc is likely to shake in the rotating process, and the fixity is poor are solved.

Description

technical field [0001] The invention relates to the related field of bonding wire processing, in particular to a wire guide machine for bonding wire production. Background technique [0002] Bonding gold wire is a gold alloy wire used as a connecting wire in integrated circuits, also known as ball bonding gold wire or lead gold wire. The gold content is ≥99.99%, and the sum of trace elements is <0.01%. There are γ-type, C-type and FA type and other three types, the latter two are used for high-speed bonding, and the trace elements are beryllium, copper, silver, etc., which have the functions of refining grains, increasing recrystallization temperature and strengthening gold. Melting and directional crystallization, the ingot is cold processed into a material after homogenization, or manufactured by a liquid extrusion process, bonding gold wire is an important material in the microelectronics industry, used as a connecting wire between a chip and a lead frame, and is proce...

AI Technical Summary

Problems solved by technology

[0004] 1. In the existing guide wire machine for bonding wire production, the winding disc is easy to shake during the rotation process, and the fixation is poor

[0005] 2. The existing guide wire machine for bonding wire production has a complicated guide wire process and poor height adjustment performance

[0006] 3. The existing guide wire machine for bonding wire production, in the process of guide wire, due to the dryness of the wire and the limitation of the environment, it is easy to cause the wire to break and lack of lubrication

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