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Laser module and electronic equipment

A laser module and laser technology, applied in the direction of lasers, laser parts, semiconductor lasers, etc., can solve the problems of low heat dissipation efficiency of laser chips, achieve the effect of ensuring work performance and service life, and improving heat dissipation efficiency

Active Publication Date: 2019-04-05
VIVO MOBILE COMM CO LTD
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Problems solved by technology

[0004] The embodiment of the present invention provides a laser module and electronic equipment to solve the problem of low heat dissipation efficiency of the laser chip in the existing laser module

Method used

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  • Laser module and electronic equipment
  • Laser module and electronic equipment
  • Laser module and electronic equipment

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0021] Please refer to Figure 1 to Figure 5 , figure 1 is a cross-sectional view of a laser module provided by an embodiment of the present invention; figure 2 yes figure 1 The top view of the laser module in the middle; image 3 yes figure 1 The structural diagram of the heat sink in the provided laser module; Figure 4 yes figure 1 The front view of the heat sink in the provided laser module when it is not assembled; Figure 5 yes Figure 4...

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Abstract

The invention provides a laser module and electronic equipment. The laser module comprises an optical module, a laser chip, a power supply structure, a package structure and a cooling structure, wherein the laser chip is arranged at one side of the optical module, the power supply structure is connected to the laser chip, an accommodating cavity is formed in the package structure, at least one part of optical module is accommodated in the accommodating cavity, the cooling structure sleeves an outer side of the package structure, and the cooling structure props against the power supply structure. With the laser module provided by the technical scheme of the embodiment of the invention, the problem of low cooling efficiency of an existing laser module is solved.

Description

technical field [0001] The invention relates to the technical field of laser equipment, in particular to a laser module and electronic equipment. Background technique [0002] At present, 3D recognition technology is widely used in face recognition unlocking, payment and other fields. The laser module is an indispensable core component of 3D recognition. It is mainly used to emit ultra-short femtosecond pulses or project specific light shapes so that the system can obtain depth information. As one of the most important components in the laser module, the laser chip plays a key role in the working process of the laser module. [0003] The laser chip is a semiconductor device, which is sensitive to temperature. The higher the temperature, the lower the photoelectric conversion efficiency of the laser chip; the high temperature will easily damage the lattice structure of the laser chip and reduce the service life of the laser chip. However, in the existing laser modules, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024
CPCH01S5/02469H01S5/02476H01S5/02208H01S5/02218H01S5/02253H01S5/02257H01S5/02345H01S5/0225H01S5/0235
Inventor 周锋
Owner VIVO MOBILE COMM CO LTD
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