Heat dissipation device of electronic element

Abstract

The invention discloses a heat dissipation device of an electronic element. The device comprises a heat dissipation cold plate and a uniform temperature material, and the uniform temperature materialis arranged between the heat dissipation cold plate and the high heat flux electronic element. By adding the uniform temperature material, the contact area between the heat dissipation cold plate andthe high-heat-flux electronic element is greatly increased, meanwhile, the interface filling effect is achieved, and the thermal resistance value between the heat dissipation cold plate and the electronic element is reduced. And compared with air cooling and common liquid cooling, the heat dissipation efficiency is higher.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a heat dissipation device for electronic components. Background technique [0002] With the continuous development of science and technology, electronic products have begun to develop towards miniaturization. The miniaturization of electronic components not only reduces the shape, but also increases the power loss density of electronic devices, making the heating elements of electronic devices more concentrated, resulting in a rapid increase in heat generation per unit area, and a rapid rise in its operating temperature. Therefore, heat dissipation technology is an important factor restricting the miniaturization of electronic devices. Studies have shown that when the electronic device is working, the reliability of the system will decrease by 50% for every 10°C increase in temperature. More than half of electronic component failures are caused by excessive operating temperat...

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Problems solved by technology

[0004] Aiming at the problems in the related art that the heat dissipation is greatly affected by the ambient temperature, the contact heat dissipation area of ​​the electronic components is small, and the contact surface thermal resistance is large, resulting in low heat dissipation efficiency, the present invention proposes a heat dissipation device for electronic components with high heat flux density, which changes the electronic components The heat dissipation method increases the effective heat dissipation area of ​​the cold plate, so that the entire heat dissipation device has a higher heat dissipation efficiency

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