Sealant lapping device and preparation method of sealant lapping sample
A lap joint device and sample preparation technology, which is applied in the field of sealant lap joint device and sealant lap joint sample preparation, can solve the problem of inability to accurately control the bonding area of the substrate and the thickness of the adhesive layer, and the fluctuation of the shear strength of the sealant Larger, test structure errors and other problems, to achieve the effect of improving test efficiency, accurate thickness and bonding area, and uniform distribution
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[0056] Typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and that the description and drawings therein are illustrative in nature and not intended to limit the present invention. invention.
[0057] In the following description of various exemplary embodiments of the invention, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of example various exemplary structures, systems and step. It is to be understood that other specific arrangements of components, structures, exemplary means, systems and steps may be utilized and structural and functional modifications may be made without departing from the scope of the present invention. Moreover, while the terms "upper," "lower," "be...
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