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A semiconductor wafer leveling device and method thereof

A technology for leveling devices and semiconductors, which can be used in measuring devices, analyzing materials, and analyzing materials by optical means, which can solve the problems of wrinkling and warping of semiconductor wafers.

Active Publication Date: 2019-04-30
UTECHZONE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to solve the situation that there may still be wrinkles and warping on the surface of the semiconductor tablet when the vacuum suction device is used to absorb the semiconductor tablet in the prior art

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  • A semiconductor wafer leveling device and method thereof
  • A semiconductor wafer leveling device and method thereof
  • A semiconductor wafer leveling device and method thereof

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Embodiment Construction

[0019] The detailed description and technical content of the present invention are described below with reference to the drawings.

[0020] see figure 1 , is a schematic structural diagram of the first embodiment of the present invention, as shown in the figure:

[0021] The following is a description of a preferred embodiment of the present invention. The present embodiment provides a semiconductor wafer leveling device 100, which is used in an optical inspection device to level the surface of the semiconductor wafer for the purpose of aligning the semiconductor wafer. The surface of the sheet was tested. The optical inspection equipment can be specifically used for materials such as printed circuit boards (Printed Circuit Board, PCB), flexible printed circuit boards (FPC), wafers (Wafer), panels (Panel), polarizers, etc. The workpiece is detected, but the present invention is not limited to the above-mentioned embodiment. The semiconductor wafer leveling device 100 includ...

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Abstract

A semiconductor wafer leveling device is used on optical detection equipment to level the semiconductor wafer, wherein the leveling device comprises a vacuum adsorption carrying platform and one or more gas positive pressure providers. The vacuum adsorption carrying platform is used for arranging the semiconductor wafer and is provided with a plurality of vacuum adsorption areas which can be opened and closed independently. The gas positive pressure provider is arranged on one side of the vacuum adsorption carrying platform and is used for providing positive pressure for the semiconductor wafer on the vacuum adsorption carrying platform, wherein the gas positive pressure providers can move among the plurality of vacuum adsorption areas, and the vacuum adsorption carrying platform can correspondingly start the vacuum adsorption areas at the corresponding positions according to the positions of the gas positive pressure providers so as to flatten the semiconductor wafer.

Description

technical field [0001] The present invention provides a semiconductor material leveling device and a method thereof, in particular to a semiconductor material leveling device and a method for use on an optical detection device and performing dust removal at the same time during detection. Background technique [0002] Automated Optical Inspection (AOI) generally refers to a technology that uses machine vision as a detection standard. Compared with human eye detection technology, this technology has the advantages of high speed and high precision. The application level can cover research and development of high-tech industries, manufacturing quality control, as well as national defense, people's livelihood, medical care, environmental protection, electric power or other related fields. [0003] In the field of automatic optical inspection, to inspect the wafer, the common method is to first install the wafer on the stage, and then use a vacuum method to provide negative press...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/84
CPCG01N21/84G01N2021/8411
Inventor 邹嘉骏赖宪平
Owner UTECHZONE CO LTD
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