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A packaging substrate, a semiconductor device and a manufacturing method of the semiconductor device

A technology for encapsulating substrates and manufacturing methods, which is applied to semiconductor devices, electrical solid devices, electrical components, etc., can solve the problems of short service life of semiconductor devices, poor thermal conductivity of white glue, and inability to dissipate in time, so as to prolong the service life, Avoid cracking, avoid the effect of white glue cracking

Pending Publication Date: 2019-04-30
APT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of using semiconductor devices, because LED chips and fluorescent sheets continue to generate heat, and the thermal conductivity of the white glue is poor, this makes the semiconductor device not only concentrate heat but also cannot dissipate it in time, resulting in accelerated aging or even cracking of the white glue. Short lifetime of semiconductor devices

Method used

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  • A packaging substrate, a semiconductor device and a manufacturing method of the semiconductor device
  • A packaging substrate, a semiconductor device and a manufacturing method of the semiconductor device
  • A packaging substrate, a semiconductor device and a manufacturing method of the semiconductor device

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Embodiment Construction

[0036] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from this description, and those skilled in the art can make similar extensions without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0037] The technical solution of the present invention will be clearly and completely described below in combination with specific embodiments and accompanying drawings.

[0038] See image 3 , is a structural schematic diagram of an embodiment of a packaging substrate of the present invention.

[0039] Such as image 3 As shown, the packaging substrate includes: a substrate 1, an electrode 2 and several heat sinks 3; the electrodes 2 and the several heat sinks 3 are arranged on the upper surface of the substrate 1, and the sever...

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Abstract

The invention discloses a packaging substrate. The packaging substrate includes a substrate, electrodes and multiple heat dissipating fins. The electrodes and the multiple heat dissipating pins are arranged on the upper surface of the substrate. The multiple heat dissipating fins are perpendicular to the upper surface of the substrate and one end face of each heat dissipating fin faces the electrodes so as to form an accommodate part around the electrodes. The accommodating part is used for accommodating an LED chip. The invention also provides a semiconductor device and a manufacturing methodthereof. The heat can be timely dissipated, white glue can be prevented from cracking and the service life of the semiconductor device can be prolonged by using the packaging substrate, semiconductordevice and manufacturing method of the semiconductor device of the invention.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a packaging substrate, a semiconductor device and a manufacturing method thereof. Background technique [0002] Such as figure 1 Shown is a schematic structural diagram of an existing semiconductor device. Such as figure 1 and figure 2 As shown, the existing semiconductor device includes a substrate 100 and an LED chip 101 fixed on the substrate 100 , the LED chip 101 is surrounded by a reflective wall 102 , and a fluorescent sheet 103 is pasted on the LED chip 101 . [0003] In the field of LED technology, since the white glue can effectively prevent light leakage from the LED chip and improve the light extraction efficiency of the semiconductor device, the reflective wall of the existing semiconductor device is basically formed by curing the white glue. However, in the process of using semiconductor devices, because LED chips and fluorescent sheets continue to generate heat, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L25/075H01L33/60H01L33/62H01L33/64
CPCH01L25/0753H01L33/483H01L33/60H01L33/62H01L33/642
Inventor 曾照明朱文敏李真真万垂铭侯宇肖国伟
Owner APT ELECTRONICS
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