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Compressible thermally conductive articles

A technology of thermally conductive materials and thermally conductive fillers, which is applied in the fields of modification through conduction and heat transfer, layered products, circuit heat devices, etc.

Inactive Publication Date: 2019-05-03
ROGERS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, the increased power of such electronic devices has resulted in more power being squeezed into denser packaging spaces
As a result, manufacturers continue to face the challenge of managing heat generation within electronic equipment

Method used

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  • Compressible thermally conductive articles
  • Compressible thermally conductive articles
  • Compressible thermally conductive articles

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0098] Sample compressible thermal pads were prepared as follows. The nearly solid polyurethane material is molded into the shape of the corrugated sheet. Examples 1 to 17 are listed in Table 2 below. In Table 2, the polyurethane material is based on PORON92 grade polyurethane foam. The overall sample thickness was 0.0309 inches (0.785 mm) with a peak-to-peak spacing across the corrugated sheet of about 0.045 inches (1.14 mm).

[0099] Sample preparation involved producing a small clamshell male-female mold with a corrugated pattern built into it. In this way, the peak-to-peak distances of all slices can be very similar. However, sample thickness will vary as the gap between the top and bottom mold plates increases. To mold the corrugated sheet, all the urethane ingredients are mixed together except the isocyanate. This includes any additives used to increase thermal conductivity. Finally, use The speed mixer blends the isocyanates. Pour the urethane and spread it ove...

Embodiment approach 1

[0108] Embodiment 1. A sheet-form compressible thermally conductive material comprising a plurality of elongated walls substantially parallel in the x-y plane, wherein the elongated walls comprise particles of a thermally conductive filler dispersed in a polymeric matrix material,

[0109] wherein said elongated walls each extend obliquely in the thickness direction from a bottom point to a top point, and wherein adjacent walls are inclined in alternating directions with respect to a perpendicular in said thickness direction.

Embodiment approach 2

[0110] Embodiment 2. The compressible thermally conductive material of embodiment 1, wherein adjacent elongate walls in the sheet are spaced apart from each other, and the elongate walls are embedded in a polymeric foam.

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Abstract

The present invention discloses a compressible and thermally conductive material in the form of a sheet comprising a plurality of elongated walls substantially parallel in an x-y plane, wherein the elongated walls comprise particles of thermally conductive filler dispersed in a polymeric matrix material. Each of the elongated walls extends in a direction of thickness that slants from a bottom point to a top point, wherein adjacent elongated walls slant in alternate directions to a vertical line in the direction of thickness. In some embodiments, the thermally conductive sheet comprises a corrugated elastomeric sheet, having front and back surfaces, wherein the corrugated elastomeric sheet has a porosity of 0 to 25%; and wherein the corrugated elastomeric sheet is optionally embedded, at least partially, in a sheet of polymeric foam having a porosity of greater than 10%. Heat management assemblies comprising such compressible thermally conductive materials are also disclosed.

Description

Background technique [0001] Thermally conductive articles, particularly compressible articles, are disclosed herein. The articles can be used to provide thermal management for electronic devices. [0002] Circuit designs for electronic equipment such as televisions, radios, computers, medical instruments, business machines, communication equipment, etc. have become smaller and thinner. Furthermore, the increased power of such electronic devices has resulted in more power being squeezed into denser packaging spaces. Accordingly, manufacturers continue to face the challenge of managing heat generation within electronic devices. [0003] To address this challenge, various designs have been developed to provide heat dissipation from the electronic device. For example, US Patent No. 6,591,897 discloses a heat sink for electronic equipment that includes a plurality of post-shaped pins mounted on the top surface of a diffuser plate, wherein the pins conduct heat away from the diff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L23/433
CPCH01L23/3737H01L23/433C09K5/14H05K1/0201H05K7/2039B32B5/18B32B27/20B32B2307/302B32B27/065B32B2264/10
Inventor 约瑟菲·普格利希
Owner ROGERS CORP