A kind of high-efficiency conductive pc/abs alloy material and preparation method thereof

Abstract

The invention relates to the field of conductive modified plastics, in particular to a high-efficiency conductive PC / ABS alloy material and a preparation method thereof, wherein the high-efficiency conductive PC / ABS alloy material is made of the following raw materials in parts by weight: polycarbonate 40-60 parts of ester, 30-50 parts of conductive ABS masterbatch, 5-10 parts of conductive fiber, 2-5 parts of toughening agent, 0.2-0.5 part of antioxidant, 0.2-0.5 part of dispersant; the conductive ABS master The pellets are made of the following raw materials in parts by weight: 75-90 parts of acrylonitrile-butadiene-styrene copolymer, 5-30 parts of conductive filler, 0.1-0.5 part of antioxidant, and 0.3-1 part of dispersant . The high-efficiency conductive PC / ABS alloy material provided by the invention can reduce the surface resistivity of the alloy material and improve the conductivity efficiency through the conductive ABS masterbatch and a small amount of conductive filler, and has broad market prospects.

Description

technical field [0001] The invention relates to the field of conductive modified plastics, in particular to a high-efficiency conductive PC / ABS alloy material and a preparation method thereof. Background technique [0002] Utilizing the partial compatibility of polycarbonate (abbreviated as PC) and acrylonitrile-butadiene-styrene copolymer (abbreviated as ABS), a plastic alloy material with a co-continuous structure can be prepared. PC / ABS alloy has the characteristics of high toughness and high fluidity, and is very suitable for the production of large parts. It has more and more applications in the fields of electronics, integrated circuit packaging, and electromagnetic shielding, and has a broad market prospect. [0003] How to prepare conductive PC / ABS alloys more reasonably and efficiently is a subject of much research at present. In the patent No. CN103102671A, thermal and conductive composite materials were prepared by a two-step method. In the first step, conductive...

AI Technical Summary

Problems solved by technology

In the patent No. CN103102671A, thermal and conductive composite materials were prepared by a two-step method. In the first step, conductive fillers were dispersed in PC / PET, and conductive fibers were added to the alloy in the second step to achieve double improvement in thermal and conductive properties of the material. , but the conductive filler is dispersed throughout the system, which is not conducive to the construction of an effective conductive network

In the patent No. CN102337015A, a self-made compatibilizer is used to improve the blending effect of PC / ABS and make its microstructure more stable, but because only one conductive filler is used and dispersed in the entire matrix, the conductivity is reduced. The effective concentration of the agent, so the amount added is too high

In the patent No. CN1108117727A, conductive fillers and conductive fibers are directly added to PC / PCT to disperse them in the matrix of the entire system. The amount of conductive agent added is too large and the cost increases

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