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High-concentration carbon hole solution for PCB and preparation method thereof

A PCB board, high-concentration technology, applied in the direction of electrical connection formation of printed components, etc., can solve problems such as pollution, resource waste environment, troublesome use process, etc., and achieve the effects of avoiding settlement, strong conductivity, and good stability

Inactive Publication Date: 2015-11-18
韶关硕成化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation of low-concentration carbon pore solution will cause trouble during transportation and use, especially after a period of use, the bath solution must be replaced, and the replacement of the bath solution will also cause waste of resources and environmental pollution

Method used

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  • High-concentration carbon hole solution for PCB and preparation method thereof
  • High-concentration carbon hole solution for PCB and preparation method thereof
  • High-concentration carbon hole solution for PCB and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The high-concentration carbon pore liquid used in the PCB board of the present embodiment 1 is calculated based on the weight percentage of the high-concentration carbon pore liquid used in the final PCB board, and its proportioning ratio is:

[0029] Conductive carbon material: CabotXC-72 is 9%;

[0030] Surfactant: alkyl polyoxyethylene ether sulfate is 4%;

[0031] Organic dispersant: sodium cellulose sulfonate is 6%;

[0032] Wetting agent: PEG600 is 1.6%;

[0033] pH regulator: sodium carbonate-sodium bicarbonate;

[0034] water balance.

[0035] The steps of the high-concentration carbon pore liquid preparation method for the PCB board of Preparation Example 1 are as follows:

[0036] 1) Prepare material A and material B,

[0037] Preparation of material A: disperse the amount of conductive carbon material in the amount of wetting agent solution, and soak for 12 hours to obtain the material A;

[0038] Preparation of material B: adding a pH regulator to the ...

Embodiment 2

[0044] The high-concentration carbon pore liquid used in the PCB board of the present embodiment 2 is calculated based on the weight percentage of the high-concentration carbon pore liquid used in the final PCB board, and its proportioning is:

[0045] Conductive carbon material: F900A superconductive carbon black is 7%;

[0046] Surfactant: sodium alkyl polyoxyethylene ether sulfate is 8%;

[0047] Organic dispersant: sodium succinate sulfonate is 4%;

[0048] Wetting agent: polyether is 2%;

[0049] pH regulator: sodium carbonate-sodium bicarbonate;

[0050] water balance.

[0051] The steps of the high-concentration carbon pore liquid preparation method for the PCB board of preparation embodiment two are as follows:

[0052] 1) Prepare material A and material B,

[0053] Preparation of material A: disperse the amount of conductive carbon material in the amount of wetting agent solution, and soak for 12 hours to obtain the material A;

[0054] Preparation of material B...

Embodiment 3

[0060] The high-concentration carbon pore liquid used in the PCB board of the present embodiment 3 is calculated based on the weight percentage of the high-concentration carbon pore liquid used in the final PCB board, and its proportioning ratio is:

[0061] Conductive carbon material: F900A superconductive carbon black is 8%;

[0062] Surfactant: potassium alkyl polyoxyethylene ether sulfate is 7%;

[0063] Organic dispersant: sodium branched alkylbenzene sulfonate is 8%;

[0064] Wetting agent: JFC is 5%;

[0065] pH regulator: sodium carbonate-sodium bicarbonate;

[0066] water balance.

[0067] The steps of the high-concentration carbon pore liquid preparation method for the PCB board of preparation embodiment three are as follows:

[0068] 1) Prepare material A and material B,

[0069] Preparation of material A: disperse the amount of conductive carbon material in the amount of wetting agent solution, and soak for 12 hours to obtain the material A;

[0070] Preparat...

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Abstract

The invention discloses a high-concentration carbon hole solution for a PCB and a preparation method thereof. The finally obtained high-concentration carbon hole solution for the PCB comprises, by weight, 7-9% of conductive carbon materials, 4-8% of surface active agents, 4-8% of organic dispersing agents, 1-5% of wetting agents, pH conditioning agents and the balance water; the use amount of the pH conditioning agents enables the pH value of the high-concentration carbon hole solution for the PCB to be adjusted to 9.5-10.5. The high-concentration carbon hole solution is quite high in conductivity, good in stability and high in effective concentration, and avoids the settling problem in the using process; moreover, the frequency of replacing bath solutions is reduced, and the high-concentration carbon hole solution is nontoxic, free of pollution and environmentally friendly.

Description

technical field [0001] The invention belongs to the field of hole metallization in the electroplating industry, and in particular relates to a high-concentration carbon hole liquid for PCB boards and a preparation method thereof. Background technique [0002] Traditional PCB hole metallization is mainly done by electroless copper plating. The process is cumbersome, and tin-palladium colloid is used in the process, which makes the copper plating process expensive, and the process will cause environmental pollution. Therefore, carbon hole electroplating technology Came into being. [0003] Carbon hole direct electroplating technology is a new technology to replace electroless copper plating. It uses carbon powder or graphite with strong conductivity as the conductive material. It is characterized by simplifying the hole metallization process, saving working hours, reducing material consumption, effectively controlling the discharge of waste water, and reducing the production...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38H05K3/42
Inventor 王祥松
Owner 韶关硕成化工有限公司
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