Method for processing non-metalized semi-hole board

Abstract

The invention provides a method for processing a non-metalized semi-hole board, characterized by comprising the following steps: performing a front process, drilling, performing PTH, forming an outer-layer circuit, performing pattern plating, etching, forming a solder mask, forming characters, stamping and performing a later process. The method converts semi-hole data onto a shape mould, so that aprocess of forming a semi hole after the pattern plating and before semi hole forming is eliminated, a scratch hidden danger is reduced, and quality influence attached by the solder mask and due to the semi hole is also reduced; and in-board hole location is adopted, and one-step moulding by virtue of a mould is realized, so that the effect that semi hole accuracy can reach up less than minus orplus 0.05mm is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for non-metallized half-hole boards. Background technique [0002] With the continuous development of PCB, customers design half-hole boards in order to meet different assembly requirements. Half-hole boards are unconventional design boards with many processing procedures. The traditional non-metallized half-hole board processing process: pre-process→drilling Hole→PTH→outer layer circuit→graphic plating→gong half hole→etching→solder mask→text→die stamping→post process. [0003] The above process is generally adopted in the industry. The half hole is first drilled out of the whole hole. After the drawing is completed, the unnecessary part is cut off by CNC, and the rest is the required half hole. This process exists. The following problems: 1. The length of the process increases, which increases the cost; 2. The second drill after the drawi...

AI Technical Summary

Problems solved by technology

[0003] The above process is generally adopted in the industry. The half hole is first drilled out of the whole hole. After the drawing is completed, the unnecessary part is cut off by CNC, and the rest is the required half hole. This process exists. The following problems: 1. The length of the process increases, which increases the cost; 2. The second drill after the drawing is easy to scratch the tin surface, resulting in an open circuit after etching; 3. After the half-hole is formed, it is easy for ink to enter the hole and the hole during solder mask printing Poor oil accumulation on the sides, half-hole design on all four sides, can not be double-sided printing; 4. High precision requirements for the gong machine, suitable for hole diameters of 1.0mm and above, when the precision of the half-hole gong machine of 0.8mm cannot reach, The shape of the half hole coming out of the gong is missing