Method for processing non-metalized semi-hole board

A non-metallized, half-hole plate technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems of ink entering the hole and oil accumulation at the edge of the hole, high precision requirements of the gong machine, easy to scratch the tin surface, etc. problems, to achieve the effect of improving the quality impact of solder mask, saving production cycle, and reducing the hidden danger of scratches

Inactive Publication Date: 2019-05-10
TEAN ELECTRONICS DA YA BAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The above process is generally adopted in the industry. The half hole is first drilled out of the whole hole. After the drawing is completed, the unnecessary part is cut off by CNC, and the rest is the required half hole. This process exists. The following problems: 1. The length of the process increases, which increases the cost; 2. The second drill after the drawing is easy to scratch the tin surface, resulting in an open circuit after etc...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A method for non-metallized half-hole plate, which is characterized in that it includes the following steps: pre-process→drilling→PTH→outer circuit→pattern electroplating→etching→solder resist→character→die stamping→post-process.

[0017] Further, in the stamping process, specifically, the half-hole material is designed on the punching mold, and a 120-ton punching equipment is used to obtain half-holes at one time in the die punching. Further, the punching is positioned using positioning holes in the plate. One-time molding can effectively guarantee half-hole accuracy, and there will be no residual burrs.

[0018] In this embodiment, since the half-hole is finished in the post-process, it effectively improves the poor solder resist ink entering the hole and the oil accumulation at the edge of the hole, and does not affect double-sided printing. The half-hole with a diameter of 0.8mm can ensure that the processing accuracy is within ± Within 0.05mm.

[0019] Further, i...

Embodiment 2

[0026] A method for non-metallized half-hole plate, which is characterized in that it includes the following steps: pre-process→drilling→PTH→outer circuit→pattern electroplating→etching→solder resist→character→die stamping→post-process.

[0027] Further, in the stamping process, specifically, the half-hole material is designed on the punching die, and a 140-ton punching equipment is used to obtain half-holes at one time in the die punching. Further, the punching is positioned using positioning holes in the plate. One-time molding can effectively guarantee half-hole accuracy, and there will be no residual burrs.

[0028] In this embodiment, since the half-hole is finished in the post-process, it effectively improves the poor solder resist ink entering the hole and the oil accumulation at the edge of the hole, and does not affect double-sided printing. The half-hole with a diameter of 0.8mm can ensure that the processing accuracy is within ± Within 0.05mm.

[0029] Further, in...

Embodiment 3

[0036] A method for non-metallized half-hole plate, which is characterized in that it includes the following steps: pre-process→drilling→PTH→outer circuit→pattern electroplating→etching→solder resist→character→die stamping→post-process.

[0037] Further, in the stamping process, specifically, the half-hole material is designed on the punching die, and a 180-ton punching equipment is used to obtain half-holes at one time in the die punching. Further, the punching is positioned using positioning holes in the plate. One-time molding can effectively guarantee half-hole accuracy, and there will be no residual burrs.

[0038] In this embodiment, since the half-hole is finished in the post-process, it effectively improves the poor solder resist ink entering the hole and the oil accumulation at the edge of the hole, and does not affect double-sided printing. The half-hole with a diameter of 0.8mm can ensure that the processing accuracy is within ± Within 0.05mm.

[0039] Further, in...

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PUM

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Abstract

The invention provides a method for processing a non-metalized semi-hole board, characterized by comprising the following steps: performing a front process, drilling, performing PTH, forming an outer-layer circuit, performing pattern plating, etching, forming a solder mask, forming characters, stamping and performing a later process. The method converts semi-hole data onto a shape mould, so that aprocess of forming a semi hole after the pattern plating and before semi hole forming is eliminated, a scratch hidden danger is reduced, and quality influence attached by the solder mask and due to the semi hole is also reduced; and in-board hole location is adopted, and one-step moulding by virtue of a mould is realized, so that the effect that semi hole accuracy can reach up less than minus orplus 0.05mm is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for non-metallized half-hole boards. Background technique [0002] With the continuous development of PCB, customers design half-hole boards in order to meet different assembly requirements. Half-hole boards are unconventional design boards with many processing procedures. The traditional non-metallized half-hole board processing process: pre-process→drilling Hole→PTH→outer layer circuit→graphic plating→gong half hole→etching→solder mask→text→die stamping→post process. [0003] The above process is generally adopted in the industry. The half hole is first drilled out of the whole hole. After the drawing is completed, the unnecessary part is cut off by CNC, and the rest is the required half hole. This process exists. The following problems: 1. The length of the process increases, which increases the cost; 2. The second drill after the drawi...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 曾祥福王欣周刚
Owner TEAN ELECTRONICS DA YA BAY CO LTD
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