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Low-temperature cured epoxy resin paint and preparation method thereof

A technology for curing epoxy resin and epoxy resin, which is applied in the field of low-temperature curing epoxy resin coating, low-temperature curing epoxy resin coating and its preparation, and can solve problems such as difficult drying of paint film, unsatisfactory drying effect, and shortening of drying time.

Inactive Publication Date: 2019-05-14
广东科鼎功能材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the temperature is below 15°C, the paint film dries very slowly. In order to shorten the drying time, the drier blue (dimethylaminomethyl) benzene is often added, but the drying effect is not ideal, especially below 5°C, the paint film is difficult to dry

Method used

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  • Low-temperature cured epoxy resin paint and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0026] A low-temperature curing epoxy resin coating mainly consists of the following raw materials in parts by weight:

[0027] 80 parts of epoxy resin, 5 parts of di-n-butylamine, 30 parts of butyl acetate and 30 parts of hydroxyl-NCO curing agent.

[0028] A preparation method for low-temperature curing epoxy resin coating, comprising the following steps:

[0029] (1) Butyl acetate heating: raise the temperature of butyl acetate to 80°C;

[0030] (2) Epoxy resin dissolves: Epoxy resin is added in the butyl acetate that heats up through step (1), and carry out stirring and dissolving to obtain epoxy resin solution;

[0031] (3) Adding di-n-butylamine and curing agent: adding di-n-butylamine and hydroxyl-NCO curing agent dropwise to the epoxy resin solution of step (2) at 80°C;

[0032] (4) heat preservation: after completing the dropwise addition of step (3), heat preservation for 2 hours to obtain a finished product.

Embodiment 2

[0034] A low-temperature curing epoxy resin coating mainly consists of the following raw materials in parts by weight:

[0035] 100 parts of epoxy resin, 20 parts of di-n-butylamine, 50 parts of butyl acetate and 50 parts of hydroxyl-NCO curing agent.

[0036] A preparation method for low-temperature curing epoxy resin coating, comprising the following steps:

[0037] (1) Butyl acetate heating: raise the temperature of butyl acetate to 80°C;

[0038] (2) Epoxy resin dissolves: Epoxy resin is added in the butyl acetate that heats up through step (1), and carry out stirring and dissolving to obtain epoxy resin solution;

[0039] (3) Adding di-n-butylamine and curing agent: adding di-n-butylamine and hydroxyl-NCO curing agent dropwise to the epoxy resin solution of step (2) at 80°C;

[0040] (4) heat preservation: after completing the dropwise addition of step (3), heat preservation for 2 hours to obtain a finished product.

Embodiment 3

[0042] A low-temperature curing epoxy resin coating mainly consists of the following raw materials in parts by weight:

[0043] 120 parts of epoxy resin, 30 parts of di-n-butylamine, 70 parts of butyl acetate and 70 parts of hydroxyl-NCO curing agent.

[0044] A preparation method for low-temperature curing epoxy resin coating, comprising the following steps:

[0045] (1) Butyl acetate heating: raise the temperature of butyl acetate to 80°C;

[0046] (2) Epoxy resin dissolves: Epoxy resin is added in the butyl acetate that heats up through step (1), and carry out stirring and dissolving to obtain epoxy resin solution;

[0047] (3) Adding di-n-butylamine and curing agent: adding di-n-butylamine and hydroxyl-NCO curing agent dropwise to the epoxy resin solution of step (2) at 80°C;

[0048] (4) heat preservation: after completing the dropwise addition of step (3), heat preservation for 2 hours to obtain a finished product.

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Abstract

The invention discloses low-temperature cured epoxy resin paint which mainly comprises, by weight, 80-120 parts of epoxy resin, 5-30 parts of di-n-butylamine, 30-70 parts of n-butyl acetate and 30-70parts of hydroxy-NCO curing agents. A preparation method of the paint includes the steps:(1) n-butyl acetate heating:heating the n-butyl acetate to reach the temperature of 75-90 DEG C; (2) epoxy resin dis: adding the epoxy resin into the n-butyl acetate and stirring and dissolving the epoxy resin to obtain epoxy resin (3) di-n-butylamine adding: dropping the di-n-butylamine into the epoxy resin solution at the temperature of 75-85 DEG C;(4) heat preservation: preserving heat for 1.5-3 hours after dropping to obtain a finished product. As the hydroxy-NCO curing agents are adopted and an epoxygroup on the epoxy resin is changed into hydroxy through the di-n-butylamine, an epoxy-hydroxy-NCO curing system is formed in curing under the action of the hydroxy-NCO curing agents, low-temperaturereaction speed is greatly increased, and performances are basically kept unchanged.

Description

technical field [0001] The invention relates to epoxy resin, in particular to a low-temperature curing epoxy resin coating, especially a low-temperature curing epoxy resin coating and a preparation method thereof. Background technique [0002] Epoxy resin refers to the general term for a class of polymers containing more than two epoxy groups in the molecule. It is the polycondensation product of epichlorohydrin and bisphenol A or polyol. Due to the chemical activity of the epoxy group, a variety of compounds containing active hydrogen can be used to open the ring, cure and cross-link to form a network structure, so it is a thermosetting resin. Bisphenol A epoxy resin not only has the largest output and the most complete variety, but also new modified varieties are still increasing, and the quality is constantly improving. Epoxy resins are widely used because of their excellent low curing shrinkage, adhesion, abrasion resistance, electrical insulation, and chemical resista...

Claims

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Application Information

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IPC IPC(8): C09D163/00C08G59/62
Inventor 张继华
Owner 广东科鼎功能材料有限公司
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