Stable single-component epoxy surface mount adhesive in room temperature storage and preparation method thereof

An epoxy patch, one-component technology, applied in the direction of epoxy resin adhesive, adhesive, adhesive type, etc., can solve problems such as failure, shortened service life of patch adhesive, increase of viscosity of patch adhesive, etc., to achieve Good printability and consistency, high wet strength effect

Inactive Publication Date: 2010-06-30
TONSAN ADHESIVES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although latent curing agents on the market that can achieve rapid curing at medium temperatures have certain latent properties at low temperatures, they will still release organic amines at room temperature, which will increase the viscosity of the patch adhesive and affect the use
Especially when combined with low-viscosity resins such a

Method used

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  • Stable single-component epoxy surface mount adhesive in room temperature storage and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] Example 1

[0027] Epoxy resin 128 41 parts

[0028] Resorcinol epoxy resin 10 parts

[0029] 26 parts of polymerized amine epoxy resin curing agent EH4070s

[0030] Diethylene triamine 1 part

[0031] 1.0 part of dithiosalicylic acid

[0032] Organic bentonite 5 parts

[0033] 15 parts of magnesium oxide

[0034] 1.0 copies of red powder

[0035] Preparation method: Accurately weigh various raw materials according to the above formula ratio. Now add epoxy resin, reactive diluent, filler, pigment, and stabilizer to the reaction kettle in sequence, stir evenly, and then add latent curing agent, and wait until it is evenly stirred. , Add thixotropic agent, disperse evenly, and carry out vacuum defoaming treatment.

Example Embodiment

[0036] Example 2

[0037] Epoxy resin 128 31 parts

[0038] Epoxy resin E44 7 parts

[0039] 14 parts of glycerol glycidyl ether

[0040] Imidazole curing agent PN40 18 parts

[0041] Imidazole curing agent PN-H 3 parts

[0042] Caffeic acid 1.0 part

[0043] 7 parts of fumed silica

[0044] 18 parts of calcium carbonate

[0045] 1.0 copies of red powder

[0046] Preparation method: Accurately weigh various raw materials according to the above formula ratio. Now add epoxy resin, reactive diluent, filler, pigment, and stabilizer to the reaction kettle in sequence, stir evenly, and then add latent curing agent, and wait until it is evenly stirred. , Add thixotropic agent, disperse evenly, and carry out vacuum defoaming treatment. The examples listed in Table 1 and their curing characteristics and storage performance test results show that: the patch adhesive of the present invention has fast curing speed, high bonding strength, good room temperature stability, long storage time, and brings c...

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PUM

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Abstract

The invention discloses a stable single-component epoxy surface mount adhesive in room temperature storage and a preparation method thereof. The surface mount adhesive comprises the following components according to parts by weight: 30-45 parts of epoxy resin, 10-25 parts of epoxy diluent, 20-35 parts of latent curing agent, 0.5-2.0 parts of stabilizer, 5-15 parts of thixotropic agent, 15-30 parts of filler and 0.1-1.0 part of pigment. The preparation method comprises the following steps: (a) adding the epoxy resin, reactive diluent, the filler, the pigment and the stabilizer into a reactor for uniform mixing sequentially; (b) adding the latent curing agent into the above mixture for uniform mixing; and (c) adding the thixotropic agent for uniform dispersing and vacuum defoaming treatment.

Description

technical field [0001] The invention relates to an adhesive for surface mounting in the electronic industry, in particular to a one-component epoxy patch adhesive with room temperature storage stability and a preparation method thereof. Background technique [0002] With the development of the electronics industry, electronic appliances are developing toward miniaturization, light weight, multi-function, and high performance, and the application of surface mount technology SMT is becoming more and more common. Surface mount technology SMT, its process involves a variety of adhesive materials, such as patch glue for fixing components, sealant for positioning coils and some components, plug-in glue for temporarily bonding surface assembly components, etc. Among these adhesives, the most important thing for the SMT process is the patch adhesive, which mainly uses printing or pin dot patterns, cured by reflow soldering, and sticks the chip electronic components to a specific pos...

Claims

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Application Information

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IPC IPC(8): C09J163/00
Inventor 李建华
Owner TONSAN ADHESIVES INC
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