Micro-channel electronic cigarette atomization chip and preparation method thereof
An electronic cigarette and micro-channel technology, applied in the field of electronic cigarettes, can solve the problems of uneven heating of atomization chips, and achieve the effects of facilitating mass production, uniform heating, and reducing manufacturing costs
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[0033] Example 1
[0034] The structure of the micro-channel electronic cigarette vaporization chip in this embodiment is as follows:
[0035] The silicon substrate 1 is provided with an array of micropillars 2 and an inlet end 10 and an outlet end 11 on the silicon substrate 1, and the array of micropillars 2 defines a number of microchannels 9;
[0036] The glass cover 4 is provided with air holes 5 passing through the glass cover 4;
[0037] The glass cover 4 and the silicon substrate 1 are fixedly connected by an anodic bonding process.
[0038] This embodiment also provides a method for preparing a micro-channel electronic cigarette vaporization chip, which includes the following steps:
[0039] a. An array of micro-pillars 2 or an array of micro-holes 3 and an inlet end 10 and an outlet end 11 are etched on the silicon substrate 1;
[0040] b. Make an array of air holes 5 through the glass cover 4;
[0041] c. Use a bonding process to bond the silicon substrate 1 produced in step a a...
Example Embodiment
[0044] Example 2
[0045] The structure of the micro-channel electronic cigarette vaporization chip in this embodiment is as follows:
[0046] The silicon substrate 1 is provided with an array of micropores 3 and an inlet end 10 and an outlet end 11 on the silicon substrate 1, and the silicon substrate 1 is provided with a smoke liquid flow channel penetrating the micropores 3;
[0047] The glass cover 4 is provided with air holes 5 passing through the glass cover 4;
[0048] The glass cover 4 and the silicon substrate 1 are fixedly connected by an anodic bonding process.
[0049] This embodiment also provides a method for preparing a micro-channel electronic cigarette vaporization chip, which includes the following steps:
[0050] a. An array of micro-pillars 2 or an array of micro-holes 3 and an inlet end 10 and an outlet end 11 are etched on the silicon substrate 1;
[0051] b. Make an array of air holes 5 through the glass cover 4;
[0052] c. Use a bonding process to bond the silicon ...
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