Method for separating crystal-pasting glue paper with crystal grains

Abstract

The invention relates to a method for separating crystal-pasting glue paper with crystal grains. The method comprises the steps of grinding a wafer so as to obtain a wafer conforming to thickness requirement; pasting the crystal-pasting glue paper onto a back surface of the wafer conforming to the thickness requirement; and cutting the crystal-pasting glue paper by a laser. A cold expansion step of a hidden cutting process is substituted by a laser cutting process, so that the crystal-pasting glue paper is scanned by the laser along a direction of a cutting passage, the crystal-pasting glue paper and the crystal grains can be cut very well, the problem of crystal grain warpage and crack can be solved, and the product yield can be improved.

Description

technical field [0001] The invention relates to an adhesive paper treatment method, more specifically a method for separating the crystal adhesive tape from crystal grains. Background technique [0002] The competition in the memory market mainly depends on the capacity and size of the product. Large storage capacity and small size are popular. At present, 16G capacity has become popular, and 64G and 128G products will have a brighter future. Therefore, the demand for thinner and higher-capacity wafers and the development of processes have become very critical. [0003] The stealth cutting process can avoid the problems of edge chipping and splintering in traditional blade cutting due to the application of laser energy to cut products, but there are also certain problems in the existing invisible cutting process, such as the final cold expansion process, the cold expansion process first Place the entire wafer that has been ground to the target thickness and attached with t...

AI Technical Summary

Problems solved by technology

[0003] The stealth cutting process can avoid the problems of edge chipping and splintering in traditional blade cutting due to the application of laser energy to cut products, but there are also certain problems in the existing invisible cutting process, such as the final cold expansion process, the cold expansion process first Place the entire wafer that has been ground to the target thickness and attached with the adhesive tape in a sub-zero environment to embrittle the adhesive tape, and then apply an expansion force to the entire wafer, so that the adhesive tape Particle separation, but this method has relatively high performance requirements for the die-bonding paper material. When the ideal performance requirements are not met, the problem of incomplete die-bonding of the die-bonding paper will occur, and the wafer will be affected when the top is lifted. Apply a certain force, which can easily cause problems such as grain warping and cracking, such as Figure 1 to Figure 3 As shown, especially when the chip circuit layer is getting thicker and the capacity is getting bigger and bigger, it will affect the yield of the product and affect the processing of the subsequent process.

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