Bus capacitor, capacitor box, controller component and electric vehicle

Abstract

The invention discloses a bus capacitor, a capacitor box, a controller component and an electric vehicle. The bus capacitor includes a capacitor body. The capacitor body is provided with a power terminal for connecting external equipment and a radiating surface for conducting heat. The distance between the power terminal and the radiating surface is smaller than the distance between the power terminal and the radiating surface in the existing bus capacitor. Thus, without changing the internal structure of the bus capacitor or adding an additional radiator, the radiating capacity and radiatingefficiency of the bus capacitor can be improved by optimizing the radiating path of a heat source in the bus capacitor and reducing the distance of the radiating path.

Description

technical field [0001] The invention relates to the field of electric vehicles, in particular to a bus capacitor, a capacitor box, a controller assembly and the electric vehicle. Background technique [0002] With the popularization and rapid development of electric vehicles, the bus capacitor is a very critical device for electric vehicles. For the bus capacitor, the heat dissipation capability is one of its important key indicators. In order to improve the heat dissipation capability of the bus capacitor, there are currently two main design schemes for the bus capacitor: multi-core parallel connection and external heat dissipation copper substrate. However, for the above-mentioned first design scheme, there will be problems that the capacitor core capacitance, withstand voltage value, and ESR equivalent resistance value are inconsistent, and there will also be serious imbalance between multiple cores, and serious heat imbalance. problems; and for the above-mentioned secon...

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Problems solved by technology

However, for the above-mentioned first design scheme, there will be problems that the capacitor core capacitance, withstand voltage value, and ESR equivalent resistance value are inconsistent, and there will also be serious imbalance between multiple cores, and serious heat imbalance. problems; and for the above-mentioned second design scheme, there are problems such as increased bus capacitor weight and increased assembly complexity

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