PCB welding defect detecting method based on depth information

Abstract

The invention discloses a PCB welding defect detecting method based on depth information. The method comprises the following steps that depth data of a to-be-detected PCB welding area and depth data of a standard PCB welding area are collected respectively; corresponding depth images are generated according to the depth data of the two PCB welding areas respectively; standard welding images are obtained according to standard depth images, and to-be-detected welding images are obtained according to to-be-detected depth images; the standard welding images and the to-be-detected welding images are subjected to image registration; soldering positions are marked in the to-be-detected welding images, and whether or not soldering positions need pin protruding is judged according to ratio operation values of the soldering positions; the registered standard welding images and to-be-detected welding images are subjected to image differentiate operation to obtain binary images; PCB welding defects are determined according to the binary images. The PCB welding defect detecting method based on the depth information has the advantages that the amount of processed data can be reduced, the requirements for illumination conditions are low, and the false detection rate can be reduced.

Description

technical field [0001] The invention relates to the field of detection of electronic components, in particular to a method for detecting welding defects of PCB boards based on depth information. Background technique: [0002] At present, PCB board defect detection in the industry is mostly based on the two-dimensional color image information of the PCB board. The data volume in the two-dimensional color image is too large and there is a lot of useless information, and the processing speed is slow. Low, high false detection rate, by extracting the color, corner points and other features of the two-dimensional image, and then comparing with the standard board, the defects in the PCB board can be detected. Contents of the invention [0003] The purpose of the present invention is to provide a PCB board welding defect detection method based on depth information to solve the above-mentioned multiple defects caused in the prior art. [0004] A method for detecting defects in PC...

AI Technical Summary

Problems solved by technology

[0002] At present, PCB board defect detection in the industry is mostly based on the two-dimensional color image information of the PCB board. The data volume in the two-dimensional color image is too large and there is a lot of useless information, and the processing speed is slow. Low, high false detection rate, by extracting the color, corner points and other features of the two-dimensional image, and then comparing with the standard board, the defects in the PCB board can be detected

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