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Mask, mask container, and method for discharging electrostatic charge accumulated on mask

An electrostatic charge and mask technology, which is applied in the direction of instruments, photographic process of patterned surface, and originals for photomechanical processing, etc., can solve the problems of increasing the complexity of integrated circuits

Active Publication Date: 2022-07-19
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these advances have increased the complexity of handling and manufacturing integrated circuits, and in order to realize these advances, similar developments in integrated circuit processing and manufacturing are required

Method used

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  • Mask, mask container, and method for discharging electrostatic charge accumulated on mask
  • Mask, mask container, and method for discharging electrostatic charge accumulated on mask
  • Mask, mask container, and method for discharging electrostatic charge accumulated on mask

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Embodiment Construction

[0107] The following disclosure provides many different embodiments or examples for implementing different features of the present disclosure. The following disclosure describes specific examples of various components and their arrangements to simplify the description. Of course, these specific examples are not intended to be limiting. For example, if the disclosure describes that a first feature is formed on or over a second feature, it may include embodiments in which the first feature and the second feature are in direct contact, and may also include additional Embodiments in which the feature is formed between the first feature and the second feature, such that the first feature and the second feature may not be in direct contact. In addition, different examples of the following disclosure may reuse the same reference symbols and / or signs. These repetitions are for the purpose of simplicity and clarity and are not intended to limit the particular relationship between the...

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Abstract

The present disclosure provides a method for providing a mask, a mask container, and a method of discharging electrostatic charge accumulated on the mask. The mask includes a mask substrate, a reflective multilayer structure, a capping layer, an absorbing structure, and a conductive material structure. The mask substrate has a front side surface and a back side surface. The reflective multilayer structure is located over the front side surface of the mask substrate. A cover layer is located over the reflective multilayer structure. The absorbent structure is located over the cover layer. The conductive material structure is located over the sidewall surface of the mask substrate and the sidewall surface of the absorber structure.

Description

technical field [0001] The present disclosure relates to a mask and a mask container, and in particular, to a mask and a mask container that can discharge electrostatic charges accumulated on the mask. Background technique [0002] Semiconductor integrated circuits have experienced exponential growth, and technological advances in integrated circuit materials and design have produced multiple generations of integrated circuits, each of which has smaller and more complex circuits than the previous generation. However, these advances have increased the complexity of processing and manufacturing integrated circuits, and in order to realize these advances, similar developments in integrated circuit processing and manufacturing are required. During the evolution of integrated circuits, functional density (ie, the number of interconnects per chip area) typically increases while geometry size (ie, the smallest component that can be produced using a manufacturing process) decreases....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F1/40
CPCG03F1/24G03F1/66G03F1/38G03F1/40G03F7/2002
Inventor 张晓伦郭爵旗李宗彦傅中其陈立锐郑博中许哲彰
Owner TAIWAN SEMICON MFG CO LTD