Substrate processing method

Abstract

The invention relates to the field of substrate processing, in particular to a substrate processing method used for keeping BM (black ink) at the edge of the surface of a touch screen substrate from being corroded. The blank area is reserved on the edge of the first surface of the small-piece type substrate in advance, and then the BM pattern is printed twice, so that the BM on the edge of the surface of the substrate can be completely prevented from being corroded, and the thickness of the BM layer and the color uniformity are ensured.

Description

technical field [0001] The invention relates to the field of substrate processing, and more specifically relates to a substrate processing method for keeping BM (black ink) on the surface edge of a touch screen substrate from being corroded. Background technique [0002] With the advent of the era of touch display, the development trend of smartphones and tablet computers is gradually transitioning to light and thin, which requires the thickness and weight of the touch screen to be greatly reduced. Similarly, the surface strength requirements of the cover plate used for screen protection and the touch screen substrate are extremely stringent. [0003] At present, in order to ensure the surface strength of the substrate, it is necessary to carry out two substrate strengthening treatments, so that the substrate strength meets the production requirements, which are specifically manifested in the following two touch screen production technologies. [0004] One is the production...

AI Technical Summary

Problems solved by technology

When chemical etching is used for secondary strengthening treatment, such as figure 1 As shown, it is very easy to corrode the printed BM at the edge, resulting in appearance problems such as BM peeling off and BM missing on the substrate, forming a BM peeling area

[0008] In order to solve the appearance problems such as BM peeling and BM loss on the substrate caused by BM corrosion, the traditional technical solution is to re-print BM in the BM missing and peeling area after the etching is completed, but this technical solution is difficult to maintain the BM layer. The uniformity of the thickness, and the bonding effect between the first printed BM and the subsequent printed BM and the substrate is not good, which will cause new production problems in the later stage

[0009] Based on the defects of the traditional reprinting method, there are currently solutions such as attaching an acid-proof film and using corrosion-resistant BM to try to solve these problems, but none of them can completely prevent the BM on the edge of the substrate surface from being corroded, or the color of the BM will be uneven. new technical issues

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