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An under-screen optical fingerprint identification module and an electronic device

A technology for electronic equipment and modules, applied in character and pattern recognition, instruments, computer parts, etc., can solve the problems of low production and assembly efficiency of fingerprint recognition modules, low production efficiency, etc., to improve imaging quality, reduce Brightness, the effect of improving the signal-to-noise ratio

Active Publication Date: 2019-05-28
SILEAD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As is known, the efficiency of the module factory is much lower than that of the packaging factory when performing the same process.
As a result, the production efficiency of the existing identification components used in under-screen optics is very low
As a result, the production and assembly efficiency of fingerprint recognition modules used for under-screen optics is not high

Method used

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  • An under-screen optical fingerprint identification module and an electronic device
  • An under-screen optical fingerprint identification module and an electronic device
  • An under-screen optical fingerprint identification module and an electronic device

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Embodiment Construction

[0071] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0072] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or a central element may also exist. When an element is considered to be "connected" to another element, it can be directly connected to the other element or an intermediate e...

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Abstract

The invention provides an under-screen optical fingerprint identification module and an electronic device. The identification module comprises a conductive substrate, an identification assembly arranged on the conductive substrate, a light sensing chip which is used for receiving the target signal light reflected by a target organism above the display screen when the identification assembly moduleis below the display screen and at least comprises a metal layer, a protection assembly located above the light-sensitive chip and provided with a light-transmitting area, and the target signal lightreaches the light-sensitive chip through the light-transmitting area, wherein a target signal arrives at the light sensing chip via the light-transmitting area, a protection cavity used for protecting the metal layer is formed below the protection assembly, and the metal layer is accommodated in the protection cavity, or the light-sensitive chip forms a part of the inner wall of the protection cavity; and a conductive path of which one end is conductively connected with the metal layer, and the other end is conductively connected with the conductive substrate through reflow soldering. The identification module provided by the embodiment of the invention is relatively higher in production and assembly efficiency.

Description

Technical field [0001] The present invention relates to the technical field of under-screen optics, and in particular to an identification module for under-screen optical fingerprints, and electronic equipment using or configured with the identification module. Background technique [0002] The description in this section only provides background information related to the disclosure of the present invention, and does not constitute prior art. [0003] The under-screen optical fingerprint recognition technology has been rapidly developed and applied because it does not occupy the surface space of electronic devices (such as smart phones). [0004] At present, most of the processes of fingerprint recognition modules used in the under-screen optical fingerprint recognition components are completed in the module factory. Specifically, electronic components such as capacitors and resistors can be soldered to FPC (Flexible Printed Circuit) by reflow soldering, and then the FPC is transfe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
Inventor 焉逢运刘文涛谢詹奇孙云刚
Owner SILEAD
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